LPC3141FET180,551 NXP Semiconductors, LPC3141FET180,551 Datasheet - Page 12

• Manufacturer Part Number: LPC3141FET180,551
• Description: IC ARM9 MCU USB OTG 180TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC3000r

Specifications of LPC3141FET180,551

• Package / Case: 180-TFBGA
• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 270MHz
• Connectivity: EBI/EMI, I²C, IrDA, MMC, PCM, SPI, UART/USART, USB OTG
• Peripherals: DMA, I²S, LCD, PWM, WDT
• Number Of I /o: 20
• Program Memory Type: ROMless
• Ram Size: 192K x 8
• Voltage - Supply (vcc/vdd): 1.1 V ~ 3.6 V
• Data Converters: A/D 4x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC31
• Core: ARM926EJS
• Data Bus Width: 32 bit
• Data Ram Size: 192 KB
• Interface Type: I2C, SPI, UART
• Maximum Clock Frequency: 270 MHz
• Number Of Timers: 5
• Operating Supply Voltage: 1.2 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: OM11037
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 935289711551

NXP Semiconductors
Table 5.
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Table 6:
LPC3141_3143
Preliminary data sheet
Supply
domain
SUP1
SUP3
SUP4
SUP5
SUP8
Cell type
DIO1
DIO2
DIO4
IICC
IICD
AIO1
AIO2
AIO3
CS1
CS2
PS1
PS2
PS3
CG1
CG2
PG1
When the SDRAM is used, the supply voltage of the NAND flash, SDRAM, and the LCD interface must be the same, i.e. SUP4 and
SUP8 should be connected to the same rail. (See also
Voltage range
1.0 V to 1.3 V
2.7 V to 3.6 V
1.65 V to 1.95 V (in 1.8 V
mode)
2.5 V to 3.6 V (in 3.3 V mode)
4.5 V to 5.5 V
1.65 V to 1.95 V (in 1.8 V
mode)
2.5 V to 3.1 V (in 3.3 V mode)
Supply domains
I/O pads
Pad type
bspts3chp
bpts5pcph
mem1
bsptz40pchp
iic3m4scl
iic3mvsda
apio3v3
apio
apiot5v
vddco
vddi
vdde3v3
vdde
vddco3v3
vssco
vssis
vsse
Digital input/output
Function
Digital input/output
Digital input/output
Digital input/output
Digital input/output
Analog input/output Analog input/output; protection to external 3.3 V supply rail
Analog input/output Analog input/output
Analog input/output Analog input/output; 5 V tolerant pad-based ESD protection
Core supply
Core supply
Peripheral supply
Peripheral supply
Analog power
supply
Core ground
Core ground
Peripheral ground
All information provided in this document is subject to legal disclaimers.
Related supply pins
VDDI, VDDA12, USB_VDDA12_PLL,
VPP (OTP read)
VDDE_IOC, ADC10B_VDDA33,
USB_VDDA33_DRV, USB_VDDA33,
VPP (during OTP write)
VDDE_IOA
USB_VBUS
VDDE_IOB
Description
Bidirectional 3.3 V; 3-state output; 3 ns slew rate control; plain input;
CMOS with hysteresis; programmable pull-up, pull-down, repeater
Bidirectional 5 V; plain input; 3-state output; CMOS with programmable
hysteresis; programmable pull-up, pull-down, repeater
Bidirectional 1.8 V or 3.3 V; plain input; 3-state output; programmable
hysteresis; programmable pull-up, pull-down, repeater
I
I
-
-
-
-
-
-
-
-
2
2
C-bus; clock signal
C-bus; data signal
Rev. 0.16 — 27 May 2010
Section
6.28.3.)
Description
Digital core supply
Peripheral supply
Peripheral supply for NAND flash
interface
USB VBUS voltage
Peripheral supply for
SDRAM/SRAM/bus-based LCD
LPC3141/3143
© NXP B.V. 2010. All rights reserved.
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