ST7FLITE49K2T6TR STMicroelectronics, ST7FLITE49K2T6TR Datasheet - Page 212

IC MCU 8BIT 8K FLASH 32LQFP

ST7FLITE49K2T6TR

Manufacturer Part Number
ST7FLITE49K2T6TR
Description
IC MCU 8BIT 8K FLASH 32LQFP
Manufacturer
STMicroelectronics
Series
ST7r
Datasheet

Specifications of ST7FLITE49K2T6TR

Core Processor
ST7
Core Size
8-Bit
Speed
8MHz
Connectivity
I²C, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
24
Program Memory Size
8KB (8K x 8)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
384 x 8
Voltage - Supply (vcc/vdd)
2.4 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
32-LQFP
Processor Series
ST7FLITE4x
Core
ST7
Data Bus Width
8 bit
Data Ram Size
384 B
Interface Type
I2C, SPI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
24
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Development Tools By Supplier
ST7FLITE-SK/RAIS, ST7FLI49M-D/RAIS, STX-RLINK
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 10 Channel
For Use With
497-8399 - BOARD EVAL ST7LITE49M/STLED316S497-5858 - EVAL BOARD PLAYBACK ST7FLITE
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ST7FLITE49K2T6TR
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
ST7FLITE49K2T6TR
Manufacturer:
ST
0
Electrical characteristics
13.8
13.8.1
212/245
EMC (electromagnetic compatibility) characteristics
Susceptibility tests are performed on a sample basis during product characterization.
Functional EMS (electromagnetic susceptibility)
Based on a simple running application on the product (toggling two LEDs through I/O ports),
the product is stressed by two electromagnetic events until a failure occurs (indicated by the
LEDs).
A device reset allows normal operations to be resumed. The test results are given in the
table below based on the EMS levels and classes defined in application note AN1709.
Designing hardened software to avoid noise problems
EMC characterization and optimization are performed at component level with a typical
application environment and simplified MCU software. It should be noted that good EMC
performance is highly dependent on the user application and the software in particular.
Therefore it is recommended that the user applies EMC software optimization and
prequalification tests in relation with the EMC level requested for his application.
Table 92.
Symbol
V
V
FESD
FFTB
ESD: Electrostatic Discharge (positive and negative) is applied on all pins of the device
until a functional disturbance occurs. This test conforms with the IEC 1000-4-2
standard.
FTB: A Burst of Fast Transient voltage (positive and negative) is applied to V
V
conforms with the IEC 1000-4-4 standard.
Software recommendations
The software flowchart must include the management of runaway conditions such as:
Prequalification trials
Most of the common failures (unexpected reset and Program Counter corruption) can
be reproduced by manually forcing a low state on the RESET pin or the Oscillator pins
for 1 second.
To complete these trials, ESD stress can be applied directly on the device, over the
range of specification values. When unexpected behavior is detected, the software can
be hardened to prevent unrecoverable errors occurring (see application note AN1015).
SS
through a 100 pF capacitor, until a functional disturbance occurs. This test
Corrupted Program Counter
Unexpected reset
Critical Data corruption (control registers...)
Voltage limits to be applied on any I/O pin
applied through 100pF on V
Fast transient voltage burst limits to be
pins to induce a functional disturbance
EMS test results
to induce a functional disturbance
Parameter
DD
and V
SS
package,T
V
conforms to IEC 1000-4-2
conforms to IEC 1000-4-4
DD
T
A
=+25 °C, f
=5 V, SDIP32 package,
V
DD
A
Conditions
=+25 °C, f
=5 V, SDIP32
OSC
=8 MHz
OSC
=8 MHz
ST7LITE49K2
DD
and
Level/
Class
2B
3B

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