STR752FR2T6 STMicroelectronics, STR752FR2T6 Datasheet - Page 34

• Manufacturer Part Number: STR752FR2T6
• Description: MCU 32BIT 256KB FLASH 64-LQFP
• Manufacturer: STMicroelectronics
• Series: STR7r

Specifications of STR752FR2T6

• Core Processor: ARM7
• Core Size: 32-Bit
• Speed: 60MHz
• Connectivity: CAN, I²C, SPI, SSI, SSP, UART/USART
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 38
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 11x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-LQFP
• Processor Series: STR752x
• Core: ARM7TDMI
• Data Bus Width: 32 bit
• Data Ram Size: 16 KB
• Interface Type: CAN, I2C, SPI, SSI, SSP, USB
• Maximum Clock Frequency: 60 MHz
• Number Of Programmable I/os: 38
• Number Of Timers: 6
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, KSDK-STR750-PLUS, MCBSTR750, MCBSTR750U, MCBSTR750UME, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: STR750-MCKIT, STR750-SK/HIT, STR750-SK/IAR, STR750-SK/KEIL, STR750-SK/RAIS, STR750-EVAL, STX-PRO/RAIS, STX-RLINK, STR79-RVDK/CPP, STR79-RVDK, STR79-RVDK/UPG
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 11 Channel
• For Use With: MCBSTR750UME - BOARD EVAL MCBSTR750 + ULINK-MEMCBSTR750U - BOARD EVAL MCBSTR750 + ULINK2497-5754 - KIT STARTER IAR STR750497-5753 - KIT STARTER KEIL FOR STR7/STR9497-5752 - KIT STARTER IAR FOR STR7/STR9497-5748 - BOARD EVALUATION FOR STR750XF497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 497-5653

Electrical parameters
6.3
6.3.1
34/84
Operating conditions
General operating conditions
Subject to general operating conditions for V
Table 10.
1. Write access to Flash registers is either a program, erase, set protection or un-set protection operation.
2. If T
3. In low power dissipation state, T
Symbol
V
f
f
HCLK
PCLK
DD_IO
Thermal characteristics on page
Section 7.2: Thermal characteristics on page
V
P
T
T
18
A
D
J
A
is lower, higher PD values are allowed as long as T
Internal AHB Clock frequency
Internal APB Clock frequency
Standard Operating Voltage
Power Scheme 1 & 2
Standard Operating Voltage
Power Scheme 3 & 4
Standard Operating Voltage
Power Scheme 2 & 4
Power dissipation at T
for suffix 6 or T
suffix 7
Ambient temperature for 6 suffix
version
Ambient temperature for 7 suffix
version
Junction temperature range
General operating conditions
(2)
Parameter
A
= 105° C for
A
79).
can be extended to this range as long as T
A
= 85° C
79).
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Accessing SRAM with 0 wait
states
Accessing Flash in burst
mode, T
Accessing Flash in burst
mode
T
Accessing Flash with 0 wait
states
Write access to Flash
registers
Accessing Flash in RWW
mode
LQFP100
LQFP64
LFBGA100
LFBGA64
Maximum power dissipation
Low power dissipation
Maximum power dissipation
Low power dissipation
6 Suffix Version
7 Suffix Version
A
>85° C
DD_IO
A
J
(1)
Conditions
≤85° C
does not exceed T
, and T
A
unless otherwise specified.
(3)
(3)
J
Jmax
does not exceed T
(see
1.65
Min
-40
-40
-40
-40
-40
-40
3.0
4.5
0
0
0
0
0
0
Section 7.2:
Max
1.95
434
444
487
344
105
105
125
105
125
3.6
5.5
64
60
56
32
30
16
32
85
Jmax
(see
Unit
MHz
MHz
mW
°C
°C
°C
°C
°C
°C
V