STR752FR2T6 STMicroelectronics, STR752FR2T6 Datasheet - Page 74

MCU 32BIT 256KB FLASH 64-LQFP

STR752FR2T6

Manufacturer Part Number
STR752FR2T6
Description
MCU 32BIT 256KB FLASH 64-LQFP
Manufacturer
STMicroelectronics
Series
STR7r
Datasheet

Specifications of STR752FR2T6

Core Processor
ARM7
Core Size
32-Bit
Speed
60MHz
Connectivity
CAN, I²C, SPI, SSI, SSP, UART/USART
Peripherals
DMA, PWM, WDT
Number Of I /o
38
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
STR752x
Core
ARM7TDMI
Data Bus Width
32 bit
Data Ram Size
16 KB
Interface Type
CAN, I2C, SPI, SSI, SSP, USB
Maximum Clock Frequency
60 MHz
Number Of Programmable I/os
38
Number Of Timers
6
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, KSDK-STR750-PLUS, MCBSTR750, MCBSTR750U, MCBSTR750UME, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
STR750-MCKIT, STR750-SK/HIT, STR750-SK/IAR, STR750-SK/KEIL, STR750-SK/RAIS, STR750-EVAL, STX-PRO/RAIS, STX-RLINK, STR79-RVDK/CPP, STR79-RVDK, STR79-RVDK/UPG
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 11 Channel
For Use With
MCBSTR750UME - BOARD EVAL MCBSTR750 + ULINK-MEMCBSTR750U - BOARD EVAL MCBSTR750 + ULINK2497-5754 - KIT STARTER IAR STR750497-5753 - KIT STARTER KEIL FOR STR7/STR9497-5752 - KIT STARTER IAR FOR STR7/STR9497-5748 - BOARD EVALUATION FOR STR750XF497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Other names
497-5653

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
STR752FR2T6
Manufacturer:
STM
Quantity:
6 600
Part Number:
STR752FR2T6
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
STR752FR2T6
Manufacturer:
ST
0
Electrical parameters
74/84
General PCB design guidelines
To obtain best results, some general design and layout rules should be followed when
designing the application PCB to shield the noise-sensitive, analog physical interface from
noise-generating CMOS logic signals.
Software filtering of spurious conversion results
For EMC performance reasons, it is recommended to filter A/D conversion outliers using
software filtering techniques.
Figure 43. Power supply filtering
Use separate digital and analog planes. The analog ground plane should be connected
to the digital ground plane via a single point on the PCB.
Filter power to the analog power planes. It is recommended to connect capacitors, with
good high frequency characteristics, between the power and ground lines, placing
0.1 µF and optionally, if needed 10 pF capacitors as close as possible to the STR7
power supply pins and a 1 to 10 µF capacitor close to the power source (see
Figure
The analog and digital power supplies should be connected in a star network. Do not
use a resistor, as V
any resistance would cause a voltage drop and a loss of accuracy.
Properly place components and route the signal traces on the PCB to shield the analog
inputs. Analog signals paths should run over the analog ground plane and be as short
as possible. Isolate analog signals from digital signals that may switch while the analog
inputs are being sampled by the A/D converter. Do not toggle digital outputs near the
A/D input being converted.
43).
DDA_ADC
(3.3V or 5.0V)
POWER
SUPPLY
SOURCE
V
DD
1 to 10μF
is used as a reference voltage by the A/D converter and
STR7
DIGITAL NOISE
FILTERING
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
EXTERNAL
NOISE
FILTERING
0.1μF
0.1μF
V
V
V
V
SS
DD_IO
DDA_ADC
SSA_ADC
STR75XX

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