STR752FR2T6 STMicroelectronics, STR752FR2T6 Datasheet - Page 79

• Manufacturer Part Number: STR752FR2T6
• Description: MCU 32BIT 256KB FLASH 64-LQFP
• Manufacturer: STMicroelectronics
• Series: STR7r

Specifications of STR752FR2T6

• Core Processor: ARM7
• Core Size: 32-Bit
• Speed: 60MHz
• Connectivity: CAN, I²C, SPI, SSI, SSP, UART/USART
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 38
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 11x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-LQFP
• Processor Series: STR752x
• Core: ARM7TDMI
• Data Bus Width: 32 bit
• Data Ram Size: 16 KB
• Interface Type: CAN, I2C, SPI, SSI, SSP, USB
• Maximum Clock Frequency: 60 MHz
• Number Of Programmable I/os: 38
• Number Of Timers: 6
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, KSDK-STR750-PLUS, MCBSTR750, MCBSTR750U, MCBSTR750UME, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: STR750-MCKIT, STR750-SK/HIT, STR750-SK/IAR, STR750-SK/KEIL, STR750-SK/RAIS, STR750-EVAL, STX-PRO/RAIS, STX-RLINK, STR79-RVDK/CPP, STR79-RVDK, STR79-RVDK/UPG
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 11 Channel
• For Use With: MCBSTR750UME - BOARD EVAL MCBSTR750 + ULINK-MEMCBSTR750U - BOARD EVAL MCBSTR750 + ULINK2497-5754 - KIT STARTER IAR STR750497-5753 - KIT STARTER KEIL FOR STR7/STR9497-5752 - KIT STARTER IAR FOR STR7/STR9497-5748 - BOARD EVALUATION FOR STR750XF497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 497-5653

STR750Fxx STR751Fxx STR752Fxx STR755Fxx
7.2
7.2.1
Thermal characteristics
The maximum chip junction temperature (T
Table 10: General operating conditions on page
The maximum chip-junction temperature, T
using the following equation:
Where:
Table 48.
1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org
environment.
Symbol
–
–
–
–
–
Θ
Θ
Θ
Θ
JA
JA
JA
JA
T
Θ
P
P
chip internal power.
P
Where:
P
taking into account the actual V
level in the application.
Amax
Dmax
INTmax
I/Omax
I/Omax
JA
Thermal characteristics
is the Package Junction-to-Ambient Thermal Resistance, in ° C/W,
Thermal Resistance Junction-Ambient
LQFP 100 - 14 x 14 mm / 0.5 mm pitch
Thermal Resistance Junction-Ambient
LQFP 64 - 10 x 10 mm / 0.5 mm pitch
Thermal Resistance Junction-Ambient
LFBGA 64 - 8 x 8 x 1.7mm
Thermal Resistance Junction-Ambient
LFBGA 100 - 10 x 10 x 1.7mm
is the maximum Ambient Temperature in °C,
is the sum of P
= Σ (V
represents the maximum Power Dissipation on Output Pins.
is the product of I
OL
*I
OL
) + Σ((V
T
INTmax
Jmax
Parameter
DD
= T
DD
(1)
and P
and V
Amax
-V
OL
OH
Jmax
Jmax
/ I
I/Omax
DD
)*I
+ (P
OL
, expressed in Watts. This is the maximum
OH
) must never exceed the values given in
, in degrees Celsius, may be calculated
34.
and V
Dmax
),
(P
Dmax
OH
x Θ
/ I
JA
= P
OH
)
INTmax
of the I/Os at low and high
Package characteristics
+ P
Value
46
45
58
41
I/Omax
),
°C/W
°C/W
°C/W
°C/W
Unit
79/84