DF2166VTE33 Renesas Electronics America, DF2166VTE33 Datasheet - Page 188

MCU FLASH 3V 512K 33MHZ 144TQFP

DF2166VTE33

Manufacturer Part Number
DF2166VTE33
Description
MCU FLASH 3V 512K 33MHZ 144TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2166VTE33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, LPC, SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
106
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-TQFP, 144-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
6.6.2
As with the basic bus interface, program wait insertion or pin wait insertion using the WAIT pin is
possible in the initial cycle (full access) of the burst ROM interface. For details, see section 6.5.5,
Wait Control. Wait states cannot be inserted in a burst cycle.
Rev. 3.00, 03/04, page 146 of 830
Figure 6.28 Access Timing Example in Burst ROM Space (AST = BRSTS1 = 0)
Wait Control
Address bus
(IOSE = 0)
Data bus
AS/IOS
RD
φ
T
1
Full access
Read data
T
2
Only lower
Read data Read data
T
Burst access
1
address changes
T
1

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