DF2166VTE33 Renesas Electronics America, DF2166VTE33 Datasheet - Page 858

MCU FLASH 3V 512K 33MHZ 144TQFP

DF2166VTE33

Manufacturer Part Number
DF2166VTE33
Description
MCU FLASH 3V 512K 33MHZ 144TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2166VTE33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, LPC, SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
106
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-TQFP, 144-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
25.7
It is necessary to connect a bypass capacitor between the VCC pin and VSS pin and a capacitor
between the VCL pin and VSS pin for stable internal step-down power. An example of connection
is shown in figure 25.35.
It is recommended that a bypass capacitor be connected to
the VCC pin. (The values are reference values.)
When connecting, place a bypass capacitor near the pin.
Rev. 3.00, 03/04, page 816 of 830
Bypass
capacitor
Vcc power supply
10 µF
Usage Notes
0.01 µF
VCC
VSS
Figure 25.35 Connection of VCL Capacitor
One 0.1 µF / 0.47 µF or
two in parallel
External capacitor
for internal step-down
power stabilization
Do not connect Vcc power supply to the VCL pin.
Always connect a capacitor for internal step-down power
stabilization.
Use one or two ceramic multilayer capacitor(s)
(0.1 µF / 0.47 µF: connect in parallel when using two)
and place it (them) near the pin.
VCL
VSS

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