UPD70F3737GF-GAS-AX Renesas Electronics America, UPD70F3737GF-GAS-AX Datasheet - Page 1027
UPD70F3737GF-GAS-AX
Manufacturer Part Number
UPD70F3737GF-GAS-AX
Description
MCU 32BIT V850ES/JX3-L 100-LQFP
Manufacturer
Renesas Electronics America
Series
V850ES/Jx3-Lr
Datasheet
1.UPD70F3737GF-GAS-AX.pdf
(1071 pages)
Specifications of UPD70F3737GF-GAS-AX
Core Processor
RISC
Core Size
32-Bit
Speed
20MHz
Connectivity
CSI, EBI/EMI, I²C, UART/USART
Peripherals
DMA, LVD, PWM, WDT
Number Of I /o
84
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.2 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
UPD70F3737GF-GAS-AX
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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(1)
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Remarks 1. The V850ES/JG3-L is a lead-free product.
Soldering Method
Infrared reflow
Partial heating
The V850ES/JG3-L should be soldered and mounted under the following recommended conditions.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
μ
μ
PD70F3737GC-UEU-AX:
PD70F3738GC-UEU-AX:
2. For soldering methods and conditions other than those recommended above, please contact an NEC
3. The
Electronics sales representative.
Recommended soldering conditions for them are therefore undefined.
μ
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: Three times or less, Exposure limit: 7 days
to 72 hours)
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
PD70F3737GF-GAS-AZ and
CHAPTER 35 RECOMMENDED SOLDERING CONDITIONS
Table 35-1. Surface Mounting Type Soldering Conditions (1/2)
100-pin plastic LQFP (fine pitch) (14 × 14)
100-pin plastic LQFP (fine pitch) (14 × 14)
User’s Manual U18953EJ5V0UD
μ
Soldering Conditions
PD70F3738GF-GAS-AX are under development.
Note
(after that, prebake at 125°C for 20
IR60-207-3
Condition Symbol
Recommended
−
1025
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