AT91SAM9261SB-CU-999 Atmel, AT91SAM9261SB-CU-999 Datasheet - Page 9

• Manufacturer Part Number: AT91SAM9261SB-CU-999
• Description: IC MCU ARM9 ULTRA LP 217LFBGA
• Manufacturer: Atmel
• Series: AT91SAMr

Specifications of AT91SAM9261SB-CU-999

• Core Processor: ARM9
• Core Size: 16/32-Bit
• Speed: 190MHz
• Connectivity: EBI/EMI, I²C, MMC, SPI, SSC, UART/USART, USB
• Peripherals: DMA, LCD, POR, PWM, WDT
• Number Of I /o: 96
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: ROM
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 1.08 V ~ 1.32 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 217-LFBGA
• Processor Series: AT91SAMx
• Core: ARM926EJ-S
• Data Bus Width: 32 bit
• Data Ram Size: 16 KB
• Interface Type: 2-Wire, I2S, SPI, USB
• Maximum Clock Frequency: 190 MHz
• Number Of Programmable I/os: 96
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JTRACE-ARM-2M, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: AT91SAM-ICE, AT91-ISP, AT91SAM9261-EK
• Minimum Operating Temperature: - 40 C
• For Use With: AT91SAM9261-EK - KIT EVAL FOR AT91SAM926EJ-SAT91SAM-ICE - EMULATOR FOR AT91 ARM7/ARM9
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details

4. Package and Pinout
4.1
6242E–ATARM–11-Sep09
217-ball LFBGA Package Outline
The AT91SAM9261S is available in a 217-ball LFBGA RoHS-compliant package, 15 x 15 mm,
0.8 mm ball pitch
Figure 4-1
A detailed mechanical description is given in the section “AT91SAM9261S Mechanical Charac-
teristics” of the product datasheet.
Figure 4-1.
shows the orientation of the 217-ball LFBGA Package.
217-ball LFBGA Package Outline (Top View)
Ball A1
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
A B C D E F G H J K L M N P R T U
AT91SAM9261S
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