HD6417032F20 Renesas Electronics America, HD6417032F20 Datasheet - Page 173

IC SUPERH MPU ROMLESS 112QFP

HD6417032F20

Manufacturer Part Number
HD6417032F20
Description
IC SUPERH MPU ROMLESS 112QFP
Manufacturer
Renesas Electronics America
Series
SuperH® SH7030r
Datasheet

Specifications of HD6417032F20

Core Processor
SH-1
Core Size
32-Bit
Speed
20MHz
Connectivity
EBI/EMI, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
32
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
112-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-

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Section 8 Bus State Controller (BSC)
8.5
DRAM Interface Operation
When the DRAM enable bit (DRAME) in BCR is set to 1, area 1 becomes DRAM space and the
DRAM interface function is available, which permits direct connection of this chip to DRAMs.
8.5.1
DRAM Address Multiplexing
When the multiplex enable bit (MXE) in the DRAM area control register (DCR) is set to 1, row
addresses and column addresses are multiplexed. This allows DRAMs that require multiplexing of
row and column addresses to be connected directly to an SH microprocessor without additional
multiplexing circuits. When addresses are multiplexed (MXE = 1), setting of the DCR’s multiplex
shift bits (MXC1, MXC0) allows selection of eight, nine and ten-bit row address shifting. Table
8.10 illustrates the relationship between the MXC1/MXC0 bits and address multiplexing.
Rev. 7.00 Jan 31, 2006 page 145 of 658
REJ09B0272-0700

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