HD6417032F20 Renesas Electronics America, HD6417032F20 Datasheet - Page 536

• Manufacturer Part Number: HD6417032F20
• Description: IC SUPERH MPU ROMLESS 112QFP
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH7030r

Specifications of HD6417032F20

• Core Processor: SH-1
• Core Size: 32-Bit
• Speed: 20MHz
• Connectivity: EBI/EMI, SCI
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 32
• Program Memory Type: ROMless
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 112-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Program Memory Size: -

Section 20 Electrical Characteristics
Rev. 7.00 Jan 31, 2006 page 508 of 658
REJ09B0272-0700
Notes: 1. For t
WRH, WRL,
WRH, WRL,
AD15–AD0
AD15–AD0
WR(Read)
WR(Write)
DPH, DPL
DPH, DPL
RD(Read)
RD(Write)
A21–A0
DACK0
DACK1
DACK0
DACK1
(Read)
(Read)
(Write)
(Write)
(Write)
2. For t
3. For t
4. t
5. t
RAS
CAS
CK
Figure 20.27 DRAM Bus Cycle: (Long-Pitch, High-Speed Page Mode)
RDH
RDH
CAC2
ACC2
RAC2
is measured from A21–A0 or CAS, whichever is negated first.
is measured from A21–A0, RAS, or CAS whichever is negated first.
, use t
, use t
, use t
T
p
cyc
cyc
cyc
t
t
AD
RAC2
(n + 1) – 35 instead of t
(n + 2) – 44 instead of t
(n + 2.5) – 35 instead of t
T
r
t
*3
Row
RASD1
t
t
AD
RDD
T
c1
t
t
t
t
t
t
WDD1
ACC2
DACD1
WSD1
WPDD1
DACD3
t
Column
CASD2
*2
t
CAC2
T
c2
cyc
cyc
t
t
WSD2
DACD3
cyc
*1
t
t
RDS
DACD2
(n + 1) – t
(n + 2) – t
t
WPDH
t
t
RSD
(n + 2.5) – t
WDH
t
t
CASD3
RDH
T
c1
t
t
t
t
t
*4
WSD1
DACD3
WDD1
WPDD1
DACD1
Column
CASD2
AD
– t
RASD2
RDS
T
– t
c2
t
t
DACD3
WSD2
RDS
.
– t
.
RDS
t
t
t
DACD2
WDH
WPDH
t
t
t
CASD3
RDH
RASD2
.
*5