DSPIC30F5015-20I/PT Microchip Technology, DSPIC30F5015-20I/PT Datasheet - Page 229

• Manufacturer Part Number: DSPIC30F5015-20I/PT
• Description: Digital Signal Processor
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F5015-20I/PT

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 20 MIPS
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 52
• Program Memory Size: 66KB (22K x 24)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-TFQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC30F008 - MODULE SKT FOR DSPIC30F 64TQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: DSPIC30F501520IPT

PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
© 2008 Microchip Technology Inc.
Architecture
Trademark
Example:
dsPIC30F5015AT-30I/PF = 30 MIPS, Industrial temp., TQFP package, Rev. A
Memory Size in Bytes
0 = ROMless
1 = 1K to 6K
2 = 7K to 12K
3 = 13K to 24K
4 = 25K to 48K
5 = 49K to 96K
6 = 97K to 192K
7 = 193K to 384K
8 = 385K to 768K
9 = 769K and Up
Device ID
Flash
d s P I C 3 0 F 5 0 1 6 AT- 3 0 I / P T- 0 0 0
dsPIC30F5015/5016
Temperature
I = Industrial -40°C to +85°C
E = Extended High Temp -40°C to +125°C
PT = TQFP 10x10
PT = TQFP 12x12
S
W
A,B,C… = Revision Level
Custom ID (3 digits) or
Engineering Sample (ES)
= Die (Waffle Pack)
= Die (Wafers)
T = Tape and Reel
Package
DS70149D-page 229
Speed
30 = 30 MIPS