BSD235C L6327 Infineon Technologies, BSD235C L6327 Datasheet
BSD235C L6327
Specifications of BSD235C L6327
BSD235C L6327TR
SP000442466
Related parts for BSD235C L6327
BSD235C L6327 Summary of contents
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OptiMOS™ OptiMOS™-P 2 Small Signal Transistor Features · Complementary channel · Enhancement mode · Super Logic level (2.5V rated) · Avalanche rated · Qualified according to AEC Q101 · 100% lead-free; RoHS compliant · Halogen-free ...
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Parameter Thermal characteristics Thermal resistance, junction - ambient Electrical characteristics Static characteristics Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current Gate-source leakage current Drain-source on-state resistance Transconductance 2) 2 Performed on 40mm FR4 PCB. The ...
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Parameter Dynamic characteristics Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics Gate to source charge Gate to drain charge Switching charge Gate plateau voltage Gate to source charge ...
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Parameter Reverse Diode Diode continuous forward current Diode pulse current Diode forward voltage Reverse recovery time Reverse recovery charge Rev.2.2 Symbol Conditions =25 ° S,pulse =-0. ...
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Power dissipation (P) =f tot A 0.6 0.5 0.4 0.3 0.2 0 Drain current (P) =f parameter: V ≤-4 0.8 0.6 0.4 0 ...
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Safe operating area (P) =f =25 ° parameter Max. transient thermal impedance (P) =f(t ) ...
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Typ. output characteristics (P) =f =25 ° parameter Typ. drain-source on resistance (P) =f =25 °C ...
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Typ. transfer characteristics (P) =f |> DS(on)max parameter 0.75 0.5 0. Drain-source on-state resistance (P) =f =-0.53 A; ...
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Forward characteristics of reverse diode (P) =f parameter °C 150 ° 0 Avalanche characteristics (P) =25 Ω =f ...
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Typ. gate threshold voltage (P) =f =-1.5 µA V GS(th 1.6 1.2 0.8 2% 0.4 0 -60 - Typ. capacitances ( ...
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Typ. gate charge (P) =f =-0.53 A pulsed V GS gate D parameter 0.1 0 Drain-source breakdown voltage (P) =f =-250 µA V ...
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Package Outline: Footprint: Reflow soldering: Dimensions in mm Rev.2.2 SOT-363 Packing: page 12 BSD235C 2011-07-14 ...
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... Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system ...