NDS356AP Fairchild Semiconductor, NDS356AP Datasheet - Page 6

• Manufacturer Part Number: NDS356AP
• Description: MOSFET P-CH 30V 1.1A SSOT3
• Manufacturer: Fairchild Semiconductor
• Type: Power MOSFETr

Specifications of NDS356AP

• Fet Type: MOSFET P-Channel, Metal Oxide
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 200 mOhm @ 1.3A, 10V
• Drain To Source Voltage (vdss): 30V
• Current - Continuous Drain (id) @ 25° C: 1.1A
• Vgs(th) (max) @ Id: 2.5V @ 250µA
• Gate Charge (qg) @ Vgs: 4.4nC @ 5V
• Input Capacitance (ciss) @ Vds: 280pF @ 10V
• Power - Max: 460mW
• Mounting Type: Surface Mount
• Package / Case: 3-SSOT, SuperSOT-3
• Number Of Elements: 1
• Polarity: P
• Channel Mode: Enhancement
• Drain-source On-res: 0.2Ohm
• Drain-source On-volt: 30V
• Gate-source Voltage (max): ±20V
• Drain Current (max): 1.1A
• Power Dissipation: 500mW
• Output Power (max): Not RequiredW
• Frequency (max): Not RequiredMHz
• Noise Figure: Not RequireddB
• Power Gain: Not RequireddB
• Drain Efficiency: Not Required%
• Operating Temp Range: -55C to 150C
• Operating Temperature Classification: Military
• Mounting: Surface Mount
• Pin Count: 3
• Package Type: SuperSOT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: NDS356APTR

Typical Electrical Characteristics
Figure 13. Transconductance Variation with Drain
Figue 15. SuperSOT
Steady-State Power Dissipation versus
0.8
0.6
0.4
0.2
0.005
0.002
0.001
5
4
3
2
1
0
0.05
0.02
0.01
0
1
0
0.5
0.2
0.1
0.0001
0
1
1b
V
1a
DS
Copper Mounting Pad Area.
= - 5V
D = 0.5
0.05
0.02
0.01
0.2
0.1
-1
Single Pulse
2oz COPPER MOUNTING PAD AREA (in )
Current and Temperature
0.1
Figure 17. Transient Thermal Response Curve.
Note : Characterization performed using the conditions described in note 1b. Transient thermal response will
I , DRAIN CURRENT (A)
D
0.001
change depending on the circuit board design.
-2
TM _
0.2
3 Maximum
-3
T = -55°C
J
125°C
25°C
4.5"x5" FR-4 Board
T = 25 C
Still Air
0.01
A
0.3
(continued)
.
2
-4
o
0.4
-5
0.1
t , TIME (sec)
1
Figure 14. Maximum Safe Operating Area
0.05
0.01
0.5
0.1
20
10
5
2
1
1.4
1.3
1.2
1.1
0.9
0.8
0.1
1
0
Current versus Copper Mounting Pad Area.
1b
Figure 16. Maximum Steady-State Drain
1a
0.2
R
A
SINGLE PULSE
JA
V
T
1
GS
= See Note 1b
A
- V
2oz COPPER MOUNTING PAD AREA (in )
= 25°C
= -4.5V
0.1
0.5
DS
, DRAIN-SOURCE VOLTAGE (V)
1
P(pk)
T - T
R
R
Duty Cycle, D = t /t
0.2
J
2
10
JA
JA
t
1
A
(t) = r(t) * R
= See Note 1b
t
= P * R
2
5
4.5"x5" FR-4 Board
T = 25 C
Still Air
V
A
GS
= -4.5V
JA
0.3
1
10
.
o
(t)
JA
2
2
100
NDS356AP Rev.C
20
30
0.4
300
1