RD38F1020C0ZBL0 Intel, RD38F1020C0ZBL0 Datasheet - Page 41

• Manufacturer Part Number: RD38F1020C0ZBL0
• Manufacturer: Intel

Specifications of RD38F1020C0ZBL0

• Operating Supply Voltage (max): 3.3V
• Operating Temperature (max): 85C
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Not Compliant

6.0
7.0
7.1
7.1.1
Datasheet
Migration Guide Information
Typically, it is important to discuss footprint migration compatibility between a new product and
existing products. In this specific case, the SCSP allows the system designer to remove two
separate memory footprints for individual flash and SRAM and replace them with a single
footprint, thus resulting in an overall reduction in board space required. This implies that a new
printed circuit board would be used to take advantage of this feature.
Since the flash in SCSP shares the same features as the C3 features, conversions from the C3 are
described in AP-658 Designing for Upgrade to the Advanced+ Boot Block Flash Memory, order
number 292216.
Please contact your local Intel representation for detailed information about specific Flash +
SRAM system migrations.
System Design Considerations
This section contains information that would have been contained in a product design guide in
earlier generations. In an effort to simplify the amount of documentation, relevant system design
considerations have been combined into this document.
Background
The C3 SCSP combines the features of the C3 flash memory architecture with a low-power SRAM
to achieve an overall reduction in system board space. This enables applications to integrate
security with simple software and hardware configurations, while also combining the system
SRAM and flash into one common footprint. This section discusses how to take full advantage of
the C3 SCSP.
Flash + SRAM Footprint Integration
The SCSP memory solution can be used to replace a subset of the memory subsystem within a
design. Where a previous design may have used two separate footprints for SRAM and Flash, you
can now replace with the industry-standard I-ballout of the SCSP device. This allows for an overall
reduction in board space, which allows the design to integrate both the flash and the SRAM into
one component.
C3 SCSP Flash Memory
Intel
®
Advanced+ Boot Block Flash Memory (C3) SCSP Family
Order Number: 252636, Revision: 004
26 Aug 2005
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