RD38F1020C0ZBL0 Intel, RD38F1020C0ZBL0 Datasheet - Page 6

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RD38F1020C0ZBL0

Manufacturer Part Number
RD38F1020C0ZBL0
Description
Manufacturer
Intel
Datasheet

Specifications of RD38F1020C0ZBL0

Operating Supply Voltage (max)
3.3V
Operating Temperature (max)
85C
Mounting
Surface Mount
Lead Free Status / RoHS Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
RD38F1020C0ZBL0
Manufacturer:
ETRONTECH
Quantity:
378
C3 SCSP Flash Memory
26 Aug 2005
6
1.0
1.1
1.2
Table 1.
Introduction
This document contains the specifications for the Intel
(C3) Stacked Chip Scale Package (SCSP) device. C3 SCSP memory solutions are offered in the
following combinations:
Document Conventions
Throughout this document, the following conventions have been adopted.
Product Overview
The C3 SCSP device combines flash memory and SRAM into a single package, which provides
secure low-voltage memory solutions for portable applications.
The flash memory provides the following features:
Block Organization (x16)
32-Mbit Flash
16-Mbit Flash
2-Mbit SRAM
4-Mbit SRAM
8-Mbit SRAM
Note:
32-Mbit flash + 8-Mbit SRAM
32-Mbit flash + 4-Mbit SRAM
16-Mbit flash + 4-Mbit SRAM
16-Mbit flash memory + 2-Mbit SRAM
Voltages:
Main block(s): 32-Kword block
Parameter block(s): 4-Kword block
Enhanced security.
Instant locking/unlocking of any flash block with zero-latency
A 128-bit protection register that enables unique device identification, to meet the needs of
next generation portable applications.
Improved 12 V production programming for increased factory throughput.
Intel
— 2.7 V refers to the full voltage range, 2.7 V–3.3V
— 12 V refers to 11.4 V to 12.6 V
All words are 16 bits each.
Memory Device
®
Advanced+ Boot Block Flash Memory (C3) SCSP Family
Order Number: 252636, Revision: 004
Kwords
2048
1024
128
256
512
®
Advanced+ Boot Block Flash Memory
Datasheet

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