MT47H64M16HR-3:H Micron Technology Inc, MT47H64M16HR-3:H Datasheet - Page 114
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MT47H64M16HR-3:H
Manufacturer Part Number
MT47H64M16HR-3:H
Description
IC DDR2 SDRAM 1GBIT 84FBGA
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Series
-r
Datasheet
1.MT47H64M16HR-3H.pdf
(134 pages)
Specifications of MT47H64M16HR-3:H
Organization
64Mx16
Density
1Gb
Address Bus
16b
Access Time (max)
450ps
Maximum Clock Rate
667MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
0C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
135mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Format - Memory
RAM
Memory Type
DDR2 SDRAM
Memory Size
1G (64M x 16)
Speed
3ns
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
0°C ~ 85°C
Package / Case
84-TFBGA
Lead Free Status / RoHS Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT47H64M16HR-3:H
Manufacturer:
MICRON
Quantity:
11 200
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MT47H64M16HR-3:H
Manufacturer:
MICRON
Quantity:
20 000
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Part Number:
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Company:
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MT47H64M16HR-3:H
Manufacturer:
Micron Technology Inc
Quantity:
10 000
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MT47H64M16HR-3:H
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MICRON
Quantity:
20 000
Company:
Part Number:
MT47H64M16HR-3:H TR
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Figure 66: Data Input Timing
PRECHARGE
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. V 6/10 EN
Notes:
DQS#
Precharge can be initiated by either a manual PRECHARGE command or by an autopre-
charge in conjunction with either a READ or WRITE command. Precharge will deacti-
vate the open row in a particular bank or the open row in all banks. The PRECHARGE
operation is shown in the previous READ and WRITE operation sections.
During a manual PRECHARGE command, the A10 input determines whether one or all
banks are to be precharged. In the case where only one bank is to be precharged, bank
address inputs determine the bank to be precharged. When all banks are to be pre-
charged, the bank address inputs are treated as “Don’t Care.”
Once a bank has been precharged, it is in the idle state and must be activated prior to
any READ or WRITE commands being issued to that bank. When a single-bank PRE-
CHARGE command is issued,
mand is issued,
DQS
CK#
DM
DQ
CK
1.
2.
3. Subsequent rising DQS signals must align to the clock within
4. WRITE command issued at T0.
5. For x16, LDQS controls the lower byte and UDQS controls the upper byte.
6. WRITE command with WL = 2 (CL = 3, AL = 0) issued at T0.
t
t
DSH (MIN) generally occurs during
DSS (MIN) generally occurs during
T0
WL - t DQSS (NOM)
t
RPA timing applies, regardless of the number of banks opened.
T1
T1n
t WPRE
114
t
T2
DI
RP timing applies. When the PRECHARGE (ALL) com-
t DSH 1
T2n
t DQSL
t DSS 2
t
t
DQSS (MAX).
DQSS (MIN).
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Transitioning Data
T3
3
t DQSH
t DSH 1
T3n
1Gb: x4, x8, x16 DDR2 SDRAM
t WPST
t DSS 2
T4
Don’t Care
© 2004 Micron Technology, Inc. All rights reserved.
t
DQSS.
PRECHARGE