MT47H64M16HR-3:H Micron Technology Inc, MT47H64M16HR-3:H Datasheet - Page 22
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MT47H64M16HR-3:H
Manufacturer Part Number
MT47H64M16HR-3:H
Description
IC DDR2 SDRAM 1GBIT 84FBGA
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Series
-r
Datasheet
1.MT47H64M16HR-3H.pdf
(134 pages)
Specifications of MT47H64M16HR-3:H
Organization
64Mx16
Density
1Gb
Address Bus
16b
Access Time (max)
450ps
Maximum Clock Rate
667MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
0C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
135mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Format - Memory
RAM
Memory Type
DDR2 SDRAM
Memory Size
1G (64M x 16)
Speed
3ns
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
0°C ~ 85°C
Package / Case
84-TFBGA
Lead Free Status / RoHS Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT47H64M16HR-3:H
Manufacturer:
MICRON
Quantity:
11 200
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Part Number:
MT47H64M16HR-3:H
Manufacturer:
MICRON
Quantity:
20 000
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Part Number:
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Manufacturer:
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Company:
Part Number:
MT47H64M16HR-3:H
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT47H64M16HR-3:H
Manufacturer:
MICRON
Quantity:
20 000
Company:
Part Number:
MT47H64M16HR-3:H TR
Manufacturer:
Micron Technology Inc
Quantity:
10 000
FBGA Package Capacitance
Table 4: Input Capacitance
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. V 6/10 EN
Parameter
Input capacitance: CK, CK#
Delta input capacitance: CK, CK#
Input capacitance: Address balls, bank address balls, CS#, RAS#, CAS#, WE#, CKE, ODT
Delta input capacitance: Address balls, bank address balls, CS#, RAS#, CAS#, WE#, CKE,
ODT
Input/output capacitance: DQ, DQS, DM, NF
Delta input/output capacitance: DQ, DQS, DM, NF
Notes:
1. This parameter is sampled. V
2. The capacitance per ball group will not differ by more than this maximum amount for
3. ΔC are not pass/fail parameters; they are targets.
4. Reduce MAX limit by 0.25pF for -25, -25E, and -187E speed devices.
5. Reduce MAX limit by 0.5pF for -3, -3E, -25, -25E, and -187E speed devices.
MHz, T
with I/O balls, reflecting the fact that they are matched in loading.
any given device.
C
= 25°C, V
OUT(DC)
= V
22
DDQ
DD
= +1.8V ±0.1V, V
/2, V
OUT
Micron Technology, Inc. reserves the right to change products or specifications without notice.
(peak-to-peak) = 0.1V. DM input is grouped
1Gb: x4, x8, x16 DDR2 SDRAM
DDQ
= +1.8V ±0.1V, V
Symbol Min Max Units Notes
C
C
C
C
C
DCK
C
DIO
CK
IO
DI
I
© 2004 Micron Technology, Inc. All rights reserved.
1.0
1.0
2.5
–
–
–
REF
0.25
0.25
2.0
2.0
4.0
0.5
= V
Packaging
SS
pF
pF
pF
pF
pF
pF
, f = 100
2, 3
1, 4
2, 3
1, 5
2, 3
1