MT47H64M16HR-3:H Micron Technology Inc, MT47H64M16HR-3:H Datasheet - Page 2
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MT47H64M16HR-3:H
Manufacturer Part Number
MT47H64M16HR-3:H
Description
IC DDR2 SDRAM 1GBIT 84FBGA
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Series
-r
Datasheet
1.MT47H64M16HR-3H.pdf
(134 pages)
Specifications of MT47H64M16HR-3:H
Organization
64Mx16
Density
1Gb
Address Bus
16b
Access Time (max)
450ps
Maximum Clock Rate
667MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
0C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
135mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Format - Memory
RAM
Memory Type
DDR2 SDRAM
Memory Size
1G (64M x 16)
Speed
3ns
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
0°C ~ 85°C
Package / Case
84-TFBGA
Lead Free Status / RoHS Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT47H64M16HR-3:H
Manufacturer:
MICRON
Quantity:
11 200
Company:
Part Number:
MT47H64M16HR-3:H
Manufacturer:
MICRON
Quantity:
20 000
Company:
Part Number:
MT47H64M16HR-3:H
Manufacturer:
MICRON44
Quantity:
7 907
Company:
Part Number:
MT47H64M16HR-3:H
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT47H64M16HR-3:H
Manufacturer:
MICRON
Quantity:
20 000
Company:
Part Number:
MT47H64M16HR-3:H TR
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Table 1: Key Timing Parameters
Table 2: Addressing
Figure 1: 1Gb DDR2 Part Numbers
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. V 6/10 EN
Parameter
Configuration
Refresh count
Row address
Bank address
Column address
Package
Pb-free
84-ball 8mm x 12.5mm FBGA
60-ball 8mm x 11.5mm FBGA
60-ball 8mm x 10.0mm FBGA
Lead solder
84-ball 8mm x 12.5mm FBGA
60-ball 8mm x 10mm FBGA
60-ball 8mm x 11.5mm FBGA
Note:
Configuration
MT47H
256 Meg x 4
128 Meg x 8
64 Meg x 16
Speed Grade
1. Not all speeds and configurations are available in all packages.
-187E
-25E
-37E
-25
-3E
-3
Example Part Number: MT47H128M8CF-25
Configuration
256M4
128M8
64M16
32 Meg x 4 x 8 banks
Package
HW
HQ
HV
HR
CF
JN
CL = 3
A[11, 9:0] (2K)
256 Meg x 4
A[13:0] (16K)
400
400
400
400
400
400
BA[2:0] (8)
-
8K
-187E
Speed
-25E
-37E
-25
-3E
-3
CL = 4
t CK = 1.875ns, CL = 7
t CK = 2.5ns, CL = 5
t CK = 2.5ns, CL = 6
t CK = 3ns, CL = 4
t CK = 3ns, CL = 5
t CK = 3.75ns, CL = 4
533
533
533
667
533
533
Speed Grade
AT
IT
L
Low power
Industrial temperature
Automotive temperature
:G/:H
Revision
Data Rate (MT/s)
:
2
Revision
16 Meg x 8 x 8 banks
CL = 5
667
800
667
667
667
n/a
128 Meg x 8
A[13:0] (16K)
A[9:0] (1K)
BA[2:0] (8)
Micron Technology, Inc. reserves the right to change products or specifications without notice.
8K
1Gb: x4, x8, x16 DDR2 SDRAM
CL = 6
800
800
800
n/a
n/a
n/a
CL = 7
1066
© 2004 Micron Technology, Inc. All rights reserved.
n/a
n/a
n/a
n/a
n/a
8 Meg x 16 x 8 banks
64 Meg x 16
A[12:0] (8K)
A[9:0] (1K)
BA[2:0] (8)
8K
t
Features
RC (ns)
54
55
55
54
55
55