ADSP-BF592KCPZ Analog Devices Inc, ADSP-BF592KCPZ Datasheet - Page 2

58T4522

ADSP-BF592KCPZ

Manufacturer Part Number
ADSP-BF592KCPZ
Description
58T4522
Manufacturer
Analog Devices Inc
Datasheets

Specifications of ADSP-BF592KCPZ

Operating Temperature (min)
0C
Operating Temperature (max)
70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
64
Rohs Compliant
YES
Frequency
400MHz
Embedded Interface Type
PPI, SPI, UART
No. Of I/o's
32
Operating Temperature Range
0°C To +70°C
Digital Ic Case Style
LFCSP
No. Of Pins
64
Core Supply Voltage
1.4V
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ADSP-BF592KCPZ-2
Manufacturer:
BROADCOM
Quantity:
154
ADSP-BF592
TABLE OF CONTENTS
Features ................................................................. 1
Memory ................................................................ 1
Peripherals ............................................................. 1
Revision History ...................................................... 2
General Description ................................................. 3
REVISION HISTORY
08/10—Rev. PrB to Rev. PrC:
Numerous small corrections and additions to document.
Updated
Revised
Revised
Revised
Added 2.5 V/3.3 V specifications for most interfaces in
Specifications ........................................................ 23
Updated
Updated
Added
Portable Low-Power Architecture ............................. 3
System Integration ................................................ 3
Processor Peripherals ............................................. 3
Blackfin Processor Core .......................................... 3
Memory Architecture ............................................ 5
DMA Controllers .................................................. 8
Watchdog Timer .................................................. 8
Timers ............................................................... 8
Serial Ports .......................................................... 8
Serial Peripheral Interface (SPI) Ports ........................ 9
UART Port .......................................................... 9
Parallel Peripheral Interface (PPI) ............................. 9
TWI Controller Interface ...................................... 10
Ports ................................................................ 10
Dynamic Power Management ................................ 10
Voltage Regulation .............................................. 12
Clock Signals ..................................................... 12
Booting Modes ................................................... 13
Planned Models ........................................... 44
Core Clock (CCLK) Requirements .................. 19
Electrical Characteristics ............................... 20
Absolute Maximum Ratings ........................... 22
Processor Features ....................................... 3
Output Drive Currents ................................ 37
Capacitive Loading ..................................... 39
Rev. PrC | Page 2 of 46 | August 2010
Timing
Signal Descriptions ................................................. 16
Specifications ........................................................ 18
64-Lead LFCSP Pin assignment ................................. 42
Outline Dimensions ................................................ 44
Planned Models ..................................................... 44
Ordering Guide ..................................................... 45
Instruction Set Description .................................... 14
Development Tools .............................................. 14
Designing an Emulator-Compatible
Related Documents .............................................. 15
Related Signal Chains ........................................... 15
Operating Conditions ........................................... 18
Electrical Characteristics ....................................... 20
Absolute Maximum Ratings ................................... 22
ESD Sensitivity ................................................... 22
Package Information ............................................ 22
Timing Specifications ........................................... 23
Output Drive Currents ......................................... 37
Test Conditions .................................................. 38
Environmental Conditions .................................... 40
Surface Mount Design .......................................... 44
Processor Board (Target) ................................... 14
Preliminary Technical Data

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