ADSP-BF592KCPZ Analog Devices Inc, ADSP-BF592KCPZ Datasheet - Page 44

• Manufacturer Part Number: ADSP-BF592KCPZ
• Description: 58T4522
• Manufacturer: Analog Devices Inc

Specifications of ADSP-BF592KCPZ

• Operating Temperature (min): 0C
• Operating Temperature (max): 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 64
• Rohs Compliant: YES
• Frequency: 400MHz
• Embedded Interface Type: PPI, SPI, UART
• No. Of I/o's: 32
• Operating Temperature Range: 0°C To +70°C
• Digital Ic Case Style: LFCSP
• No. Of Pins: 64
• Core Supply Voltage: 1.4V
• Lead Free Status / RoHS Status: Compliant

ADSP-BF592
OUTLINE DIMENSIONS
Dimensions in
SURFACE MOUNT DESIGN
Table 37
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface Mount Design and Land Pattern
Standard.
Table 37. Surface Mount Design Supplement
PLANNED MODELS
The products listed in the table below are planned for
production.
1
specification which is the only temperature specification.
2
3
Model
ADSP-BF592KCPZ
ADSP-BF592BCPZ
Package
64-Lead LFCSP
Referenced temperature is ambient temperature. The ambient temperature is not a specification. Please see
Z = RoHS Compliant part.
Available with a wide variety of audio algorithm combinations sold as part of a chipset and bundled with necessary software. For a complete list, visit our website at
www.analog.com/Blackfin.
is provided as an aide to PCB design. For industry-
Figure
2, 3
2, 3
0.90
0.85
0.80
SEATING
44, are shown in millimeters.
PLANE
PIN 1
INDICATOR
BSC SQ
–40ºC to +85ºC
Package Lead Attach Type
Solder Mask Defined
Temperature
9.00
VIEW
0ºC to +70ºC
TOP
Range
0.50 BSC
* COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
EXCEPT FOR EXPOSED PAD DIMENSION
Rev. PrC | Page 44 of 46 | August 2010
1
Figure 44. 64-Lead LFCSP (CP-64-1)
0.05 MAX
0.02 NOM
Instruction
Rate (Max)
400 MHz
400 MHz
0.50
0.40
0.30
Package Solder Mask
Opening
TBD mm diameter
48
33
49
32
(BOTTOM VIEW)
EXPOSED PAD
Operating Conditions on Page 18
7.50
REF
Package Description
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Preliminary Technical Data
64-Lead LFCSP
64-Lead LFCSP
0.30
0.23
0.18
17
64
16
1
*6.25
6.20 SQ
6.15
PIN 1
INDICATOR
Package Lead Pad Size
TBD mm diameter
for junction temperature (T
Package
CP-64-4
CP-64-4
Option
J
)