CYP15G0401DXB-BGC Cypress Semiconductor Corp, CYP15G0401DXB-BGC Datasheet - Page 14

IC TXRX HOTLINK 256LBGA

CYP15G0401DXB-BGC

Manufacturer Part Number
CYP15G0401DXB-BGC
Description
IC TXRX HOTLINK 256LBGA
Manufacturer
Cypress Semiconductor Corp
Series
HOTlink II™r
Type
Transceiverr
Datasheet

Specifications of CYP15G0401DXB-BGC

Package / Case
256-LBGA Exposed Pad, 32-HLBGA
Number Of Drivers/receivers
4/4
Protocol
Multiprotocol
Voltage - Supply
3.135 V ~ 3.465 V
Mounting Type
Surface Mount
Product
PHY
Supply Voltage (min)
3.135 V
Supply Current
1.06 A
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Mounting Style
SMD/SMT
Number Of Channels
4
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
CYP15G0401DX-EVAL - IC TXRX HOTLINK 256-BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CYP15G0401DXB-BGC
Manufacturer:
CY
Quantity:
767
Part Number:
CYP15G0401DXB-BGC
Manufacturer:
CYPRESS
Quantity:
586
Part Number:
CYP15G0401DXB-BGC
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Part Number:
CYP15G0401DXB-BGC
Manufacturer:
CYPRESS
Quantity:
1
Part Number:
CYP15G0401DXB-BGC
Manufacturer:
CYPRESS/赛普拉斯
Quantity:
20 000
Document #: 38-02002 Rev. *L
Pin Descriptions
CYP(V)(W)15G0401DXB Quad HOTLink II Transceiver
BISTLE
RXLE
BOE[7:0]
LFIA
LFIB
LFIC
LFID
Bonding Control
BONDST[1:0] Bidirectional Open Drain,
Pin Name
LVTTL Input,
asynchronous,
internal pull-up
LVTTL Input,
asynchronous,
internal pull-up
LVTTL Input,
asynchronous,
internal pull-up
LVTTL Output,
Asynchronous
internal pull-up
I/O Characteristics
(continued)
Transmit and Receive BIST Latch Enable. Active HIGH. When BISTLE = HIGH, the
signals on the BOE[7:0] inputs directly control the transmit and receive BIST enables.
When the BOE[x] input is LOW, the associated transmit or receive channel is
configured to generate or compare the BIST sequence respectively. When the BOE[x]
input is HIGH, the associated transmit or receive channel is configured for normal data
transmission or reception. The specific mapping of BOE[7:0] signals to transmit and
receive BIST enables is listed in Table 10. When BISTLE returns LOW, the last values
present on BOE[7:0] are captured in the internal BIST Enable Latch. When the latch
is closed, if the device is reset (TRSTZ is sampled LOW), the latch is reset to disable
BIST on all transmit and receive channels.
Receive Channel Power-control Latch Enable. Active HIGH. When RXLE = HIGH,
the signals on the BOE[7:0] inputs directly control the power enables for the receive
PLLs and analog circuitry. When the BOE[7:0] input is HIGH, the associated receive
channel A through D PLL and analog circuitry are active. When the BOE[7:0] input is
LOW, the associated receive channel A through D PLL and analog circuitry are
powered down. The specific mapping of BOE[7:0] signals to the associated receive
channel enables is listed in Table 10. When RXLE returns LOW, the last values
present on BOE[7:0] are captured in the internal RX PLL Enable Latch. When the
device is reset (TRSTZ = LOW), the latch is reset to disable all receive channels.
BIST, Serial Output, and Receive Channel Enables. These inputs are passed to
and through the Output Enable Latch when OELE is HIGH, and captured in this latch
when OELE returns LOW. These inputs are passed to and through the BIST Enable
Latch when BISTLE is HIGH, and captured in this latch when BISTLE returns LOW.
These inputs are passed to and through the Receive Channel Enable Latch when
RXLE is HIGH, and captured in this latch when RXLE returns LOW.
Link Fault Indication Output. Active LOW. LFIx is the logical OR of four internal
conditions:
Bonding Status. These signals are only used when multiple devices are bonded
together. They communicate the status of Elasticity Buffer management events from
master device of the bonding domain to the slave devices of the same bonding
domain. These outputs change at the same character rate as the receive output data
buses, but are connected only to all the slave CYP(V)(W)15G0401DXB devices.
When MASTER = LOW, these are output signals and present the Elasticity Buffer
status from the selected master receive channel of the device configured as the
master. Receive master channel selection is performed using the RXCLKB+ and
RXCLKD+ inputs. The BONDST[1:0] Outputs of the master device must be connected
to BONDST[1:0] Inputs of all the slave devices in the bonding domain. These status
outputs indicate one of four possible conditions, on a synchronous basis, to the slave
devices. These conditions are:
00—Reserved
01—Add one K28.5 immediately following the next framing character received
10—Delete next framing character received
11—Normal data.
These outputs are driven only when the device is configured as a master, all four
channels are bonded together, and the receive parallel interface is clocked by
REFCLK↑.
1. Received serial data frequency outside expected range
2. Analog amplitude below expected levels
3. Transition density lower than expected
4. Receive Channel disabled.
Signal Description
CYW15G0401DXB
CYP15G0401DXB
CYV15G0401DXB
Page 14 of 53

Related parts for CYP15G0401DXB-BGC