LAXP2-17E-5FTN256E Lattice, LAXP2-17E-5FTN256E Datasheet - Page 2

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LAXP2-17E-5FTN256E

Manufacturer Part Number
LAXP2-17E-5FTN256E
Description
IC FPGA AUTO 17K LUTS 256-BGA
Manufacturer
Lattice
Datasheet

Specifications of LAXP2-17E-5FTN256E

Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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May 2009
Features
Table 1-1. LA-LatticeXP2 Family Selection Guide
© 2009 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
www.latticesemi.com
Device
LUTs (K)
Distributed RAM (KBits)
EBR SRAM (KBits)
EBR SRAM Blocks
sysDSP Blocks
18 x 18 Multipliers
V
GPLL
Max Available I/O
Packages and I/O Combinations
132-Ball csBGA (8x8 mm)
144-Pin TQFP (20 x 20 mm)
208-Pin PQFP (28 x 28 mm)
256-Ball ftBGA (17 x17 mm)
CC
flexiFLASH™ Architecture
AEC-Q100 Tested and Qualified
Live Update Technology
sysDSP™ Block
Embedded and Distributed Memory
sysCLOCK™ PLLs
Voltage
• Instant-on
• Infinitely reconfigurable
• Single chip
• FlashBAK™ technology
• Serial TAG memory
• Design security
• TransFR™ technology
• Secure updates with 128 bit AES encryption
• Dual-boot with external SPI
• Three to five blocks for high performance 
• 12 to 20 18x18 multipliers
• Each block supports one 36x36 multiplier or four
• Up to 276 Kbits sysMEM™ EBR
• Up to 35 Kbits Distributed RAM
• Up to four analog PLLs per device
• Clock multiply, divide and phase shifting
Multiply and Accumulate
18x18 or eight 9x9 multipliers
LA-XP2-5
LA-LatticeXP2 Family Data Sheet
166
172
100
146
1.2
172
10
12
86
5
9
3
2
1-1
Flexible I/O Buffer
Pre-engineered Source Synchronous
Interfaces
Density And Package Options
Flexible Device Configuration
System Level Support
• sysIO™ buffer supports:
• DDR / DDR2 interfaces up to 200 MHz
• 7:1 LVDS interfaces support display applications
• XGMII
• 5k to 17k LUT4s, 86 to 358 I/Os
• csBGA, ftBGA, TQFP and PQFP packages
• Density migration supported
• SPI (master and slave) Boot Flash Interface
• Dual Boot Image supported
• Soft Error Detect (SED) macro embedded
• IEEE 1149.1 and IEEE 1532 Compliant
• On-chip oscillator for initialization & general use
• Devices operate with 1.2V power supply
– LVCMOS 33/25/18/15/12; LVTTL
– SSTL 33/25/18 class I, II
– HSTL15 class I; HSTL18 class I, II
– PCI
– LVDS, Bus-LVDS, MLVDS, LVPECL, RSDS
LA-XP2-8
221
201
100
146
201
1.2
18
12
16
86
8
4
2
Introduction
DS1024
LA-XP2-17
Data Sheet DS1024
Introduction_01.1
276
201
146
201
1.2
17
35
15
20
5
4

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