LAXP2-17E-5FTN256E Lattice, LAXP2-17E-5FTN256E Datasheet - Page 49

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LAXP2-17E-5FTN256E

Manufacturer Part Number
LAXP2-17E-5FTN256E
Description
IC FPGA AUTO 17K LUTS 256-BGA
Manufacturer
Lattice
Datasheet

Specifications of LAXP2-17E-5FTN256E

Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Lattice Semiconductor
Programming and Erase Flash Supply Current
I
I
I
I
I
1. For further information on supply current, see TN1139,
2. Assumes all outputs are tristated, all inputs are con• gured as LVCMOS and held at the V
3. Frequency 0MHz (excludes dynamic power from FPGA operation).
4. A specific configuration pattern is used that scales with the size of the device; consists of 75% PFU utilization, 50% EBR, and 25% I/O con-
5. Bypass or decoupling capacitor across the supply.
6. T
7. In fpBGA packages the PLLs are connected to and powered from the auxiliary power supply. For these packages, the actual auxiliary sup-
8. When programming via JTAG.
CC
CCAUX
CCPLL
CCIO
CCJ
figuration.
ply current is the sum of I
power supply.
J
= 25°C, power supplies at nominal voltage.
Symbol
Core Power Supply Current
Auxiliary Power Supply Current
PLL Power Supply Current (per PLL)
Bank Power Supply Current (per Bank)
V
CCJ
CCAUX
Power Supply Current
and I
CCPLL
Parameter
Over Recommended Operating Conditions
. For csBGA, PQFP and TQFP packages the PLLs are powered independent of the auxiliary
8
7
Power Estimation and Management for LatticeXP2
3-5
LA-XP2-5
LA-XP2-8
LA-XP2-17
LA-XP2-5
LA-XP2-8
LA-XP2-17
Device
1, 2, 3, 4, 5
DC and Switching Characteristics
LA-LatticeXP2 Family Data Sheet
CCIO
or GND.
(25°C, Max. Supply)
Typical
Devices.
0.1
17
21
28
64
66
83
14
5
6
Units
mA
mA
mA
mA
mA
mA
mA
mA
mA

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