PC28F512P30EFA Micron Technology Inc, PC28F512P30EFA Datasheet - Page 45
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PC28F512P30EFA
Manufacturer Part Number
PC28F512P30EFA
Description
Manufacturer
Micron Technology Inc
Datasheet
1.PC28F512P30EFA.pdf
(86 pages)
Specifications of PC28F512P30EFA
Cell Type
NOR
Density
512Mb
Interface Type
Parallel/Serial
Address Bus
25b
Operating Supply Voltage (typ)
1.8V
Operating Temp Range
-40C to 85C
Package Type
BGA
Program/erase Volt (typ)
8.5 to 9.5V
Sync/async
Async/Sync
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
1.7V
Operating Supply Voltage (max)
2V
Word Size
16b
Number Of Words
32M
Supply Current
31mA
Mounting
Surface Mount
Pin Count
64
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PC28F512P30EFA
Manufacturer:
MICRON
Quantity:
1 000
Company:
Part Number:
PC28F512P30EFA
Manufacturer:
Micron Technology Inc
Quantity:
10 000
P30-65nm
Figure 14: Reset Operation Waveforms
12.3
Datasheet
45
(A) Reset during
(B) Reset during
(C) Reset during
(D) VCC Power-up to
read mode
program or block erase
P1 ≤ P2
program or block erase
P1 ≥ P2
RST# high
Power Supply Decoupling
Flash memory devices require careful power supply de-coupling. Three basic power
supply current considerations are: 1) standby current levels; 2) active current levels;
and 3) transient peaks produced when CE# and OE# are asserted and deasserted.
When the device is accessed, many internal conditions change. Circuits within the
device enable charge-pumps, and internal logic states change at high speed. All of
these internal activities produce transient signals. Transient current magnitudes depend
on the device outputs’ capacitive and inductive loading. Two-line control and correct
de-coupling capacitor selection suppress transient voltage peaks.
Because flash memory devices draw their power from VCC, VPP, and VCCQ, each power
connection should have a 0.1 µF ceramic capacitor to ground. High-frequency,
inherently low-inductance capacitors should be placed as close as possible to package
leads.
Additionally, for every eight devices used in the system, a 4.7 µF electrolytic capacitor
should be placed between power and ground close to the devices. The bulk capacitor is
meant to overcome voltage droop caused by PCB trace inductance.
RST# [P]
RST# [P]
RST# [P]
V
CC
V
V
V
V
V
V
V
0V
CC
IH
IH
IH
IL
IL
IL
P1
P2
P2
P3
Complete
Abort
Complete
Abort
Order Number:208042-05
R5
R5
R5
Apr 2010