PC28F512P30EFA Micron Technology Inc, PC28F512P30EFA Datasheet - Page 45

• Manufacturer Part Number: PC28F512P30EFA
• Manufacturer: Micron Technology Inc

Specifications of PC28F512P30EFA

• Cell Type: NOR
• Density: 512Mb
• Interface Type: Parallel/Serial
• Address Bus: 25b
• Operating Supply Voltage (typ): 1.8V
• Operating Temp Range: -40C to 85C
• Package Type: BGA
• Program/erase Volt (typ): 8.5 to 9.5V
• Sync/async: Async/Sync
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 1.7V
• Operating Supply Voltage (max): 2V
• Word Size: 16b
• Number Of Words: 32M
• Supply Current: 31mA
• Mounting: Surface Mount
• Pin Count: 64
• Lead Free Status / Rohs Status: Compliant

P30-65nm
Figure 14: Reset Operation Waveforms
12.3
Datasheet
45
(A) Reset during
(B) Reset during
(C) Reset during
(D) VCC Power-up to
read mode
program or block erase
P1 ≤ P2
program or block erase
P1 ≥ P2
RST# high
Power Supply Decoupling
Flash memory devices require careful power supply de-coupling. Three basic power
supply current considerations are: 1) standby current levels; 2) active current levels;
and 3) transient peaks produced when CE# and OE# are asserted and deasserted.
When the device is accessed, many internal conditions change. Circuits within the
device enable charge-pumps, and internal logic states change at high speed. All of
these internal activities produce transient signals. Transient current magnitudes depend
on the device outputs’ capacitive and inductive loading. Two-line control and correct
de-coupling capacitor selection suppress transient voltage peaks.
Because flash memory devices draw their power from VCC, VPP, and VCCQ, each power
connection should have a 0.1 µF ceramic capacitor to ground. High-frequency,
inherently low-inductance capacitors should be placed as close as possible to package
leads.
Additionally, for every eight devices used in the system, a 4.7 µF electrolytic capacitor
should be placed between power and ground close to the devices. The bulk capacitor is
meant to overcome voltage droop caused by PCB trace inductance.
RST# [P]
RST# [P]
RST# [P]
V
CC
V
V
V
V
V
V
V
0V
CC
IH
IH
IH
IL
IL
IL
P1
P2
P2
P3
Complete
Abort
Complete
Abort
Order Number:208042-05
R5
R5
R5
Apr 2010