PC28F512P30EFA Micron Technology Inc, PC28F512P30EFA Datasheet - Page 6
PC28F512P30EFA
Manufacturer Part Number
PC28F512P30EFA
Description
Manufacturer
Micron Technology Inc
Datasheet
1.PC28F512P30EFA.pdf
(86 pages)
Specifications of PC28F512P30EFA
Cell Type
NOR
Density
512Mb
Interface Type
Parallel/Serial
Address Bus
25b
Operating Supply Voltage (typ)
1.8V
Operating Temp Range
-40C to 85C
Package Type
BGA
Program/erase Volt (typ)
8.5 to 9.5V
Sync/async
Async/Sync
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
1.7V
Operating Supply Voltage (max)
2V
Word Size
16b
Number Of Words
32M
Supply Current
31mA
Mounting
Surface Mount
Pin Count
64
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PC28F512P30EFA
Manufacturer:
MICRON
Quantity:
1 000
Company:
Part Number:
PC28F512P30EFA
Manufacturer:
Micron Technology Inc
Quantity:
10 000
1.3
Table 1:
Datasheet
6
Flash Die Virtual Chip Enable Truth Table for 2-Gbit (1-Gbit/1-Gbit) Devices
Virtual Chip Enable Description (2-Gbit)
The P30-65nm device employs a Virtual Chip Enable to combine two 1-Gbit dies with a
common chip enable, CE#, for Easy BGA packages. Address A27 is then used to select
between the die pair with CE# asserted. When chip enable is asserted and A27 is low
(
the upper flash die is selected.
V
IL
Lower Flash Die
Upper Flash Die
), the lower flash die is selected; when chip enable is asserted and A27 is high (
Die Selected
CE#
L
L
Order Number: 208042-05
A27
H
L
P30-65nm
Apr 2010
V
IH
),