GRM1885C1H101J Murata, GRM1885C1H101J Datasheet - Page 151

• Manufacturer Part Number: GRM1885C1H101J
• Manufacturer: Murata

Specifications of GRM1885C1H101J

• Capacitance: 100pF
• Tolerance (+ Or -): 5%
• Voltage: 50VDC
• Temp Coeff (dielectric): C0G
• Operating Temp Range: -55C to 125C
• Mounting Style: Surface Mount
• Package / Case: 0603
• Construction: SMT Chip
• Case Style: Ceramic Chip
• Failure Rate: Not Required
• Wire Form: Not Required
• Product Length (mm): 1.6mm
• Product Depth (mm): 0.8mm
• Product Height (mm): 0.8mm
• Product Diameter (mm): Not Requiredmm
• Dc: 07+
• Lead Free Status / Rohs Status: Compliant

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
6. Electrical Test on Printed Circuit Board
1. Confirm position of the support pin or specific jig, when
7. Printed Circuit Board Cropping
1. After mounting a capacitor on a printed circuit board, do
2. Check of the cropping method for the printed circuit
!Caution
inspecting the electrical performance of a capacitor after
mounting on the printed circuit board.
1-1. Avoid bending printed circuit board by the pressure
1-2. Avoid vibration of the board by shock when a test pin
not apply any stress to the capacitor that is caused by
bending or twisting the board.
1-1. In cropping the board, the stress as shown right may
board in advance.
2-1. Printed circuit board cropping shall be carried out by
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
of a test pin, etc.
The thrusting force of the test probe can flex the PCB,
resulting in cracked chips or open solder joints.
Provide support pins on the back side of the PCB to
prevent warping or flexing.
contacts a printed circuit board.
cause the capacitor to crack.
Try not to apply this type of stress to a capacitor.
using a jig or an apparatus to prevent the mechanical
stress which can occur to the board.
(1) Example of a suitable jig
Recommended example: the board should be
pushed as close to the near the cropping jig as
possible and from the back side of board in order
to minimize the compressive stress applied to
capacitor.
Not recommended example* when the board is
pushed at a point far from the cropping jig and
from the front side of board as below, the
capacitor may form a crack caused by the tensile
stress applied to capacitor.
Printed Circuit Board
Recommended
Components
Load Point
Direction of Load
[Not Recommended]
[Recommended]
[Outline of Jig]
Printed Circuit Board
Printed Circuit Board
[Bending]
[Twisting]
Load Point
Not recommended
Components
Continued on the following page.
Test-pin
Boad Cropping Jig
Test-pin
Direction of Load
V-groove
Peeling
!Caution
Support Pin
149
C02E.pdf
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