GRM1885C1H101J Murata, GRM1885C1H101J Datasheet - Page 199
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GRM1885C1H101J
Manufacturer Part Number
GRM1885C1H101J
Description
Manufacturer
Murata
Datasheet
1.GRM1885C1H101J.pdf
(220 pages)
Specifications of GRM1885C1H101J
Capacitance
100pF
Tolerance (+ Or -)
5%
Voltage
50VDC
Temp Coeff (dielectric)
C0G
Operating Temp Range
-55C to 125C
Mounting Style
Surface Mount
Package / Case
0603
Construction
SMT Chip
Case Style
Ceramic Chip
Failure Rate
Not Required
Wire Form
Not Required
Product Length (mm)
1.6mm
Product Depth (mm)
0.8mm
Product Height (mm)
0.8mm
Product Diameter (mm)
Not Requiredmm
Dc
07+
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
GRM1885C1H101JA01D
Manufacturer:
MURATA
Quantity:
640 000
Company:
Part Number:
GRM1885C1H101JA01D
Manufacturer:
MURATA
Quantity:
208 000
Company:
Part Number:
GRM1885C1H101JA01J
Manufacturer:
MURATA
Quantity:
170 000
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
*1 "Room condition" Temperature: 15 to 35D, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa
*2 "C" expresses nominal capacitance value (pF).
No.
12
13
14
15
Continued from the preceding page.
Vibration
Resistance
Resistance
to Soldering
Heat
Deflection
Solderability of
Termination
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Item
Appearance
Capacitance
D.F.
Q
Appearance
Capacitance
Change
I.R.
Dielectric
Strength
No defects or abnormalities
Within the specified tolerance
No cracking or marking defects should occur.
75% of the terminations are to be soldered evenly and continuously.
No marking defects
More than 1,000MΩ
In accordance with item No.4
Char.
Char.
X7R
X7R
SL
SL
4.5Z2.0
4.5Z3.2
5.7Z2.8
5.7Z5.0
LZW
(mm)
Within T2.5% or T0.25pF
(Whichever is larger)
QU400W20C*
QU1000
Capacitance Change
Specification
Within T10%
3.5
3.5
4.5
4.5
D.F.V0.025
a
d
Specifications
2
100
(CU30pF)
(CF30pF)
b
c
a
Fig. 2
Dimension (mm)
7.0
7.0
8.0
8.0
b
4.5
t : 1.6
2.4
3.7
3.2
5.6
c
GA3 Series Specifications and Test Methods
1.0
d
Solder the capacitor to the test jig (glass epoxy board).
The capacitor should be subjected to a simple harmonic motion
having a total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 55Hz. The
frequency range, from 10 to 55Hz and return to 10Hz, should be
traversed in approximately 1 min. This motion should be applied
for a period of 2 hrs. in each of 3 mutually perpendicular
directions (total of 6 hrs.).
Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 2.
Then apply a force in the direction shown in Fig. 3. The soldering
should be done using the reflow method and should be
conducted with care so that the soldering is uniform and free of
defects such as heat shock.
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion).
Immerse in solder solution for 2T0.5 sec.
Immersing speed: 25T2.5mm/s
Temp. of solder: 245T5°C Lead Free Solder (Sn-3.0Ag-0.5Cu)
#Immersing speed: 25T2.5mm/s
#Pretreatment for X7R char.
*Preheating
Preheat the capacitor as table. Immerse the capacitor in solder
solution at 260T5D for 10T1 sec. Let sit at room condition*
24T2 hrs., then measure.
Perform a heat treatment at 150
let sit for 24T2 hrs. at room condition*
Step
1
2
235T5°C H60A or H63A Eutectic Solder
Glass Epoxy Board
R230
Capacitance meter
Temperature
100 to 120D
170 to 200D
45
Fig. 3
Test Method
20 50
45
Continued on the following page.
Pressurize
W00
Y10
Pressurizing
speed: 1.0mm/s
Flexure=1
D for 60T5 min. and then
1
.
Solder resist
Cu
(in mm)
1 min.
1 min.
Time
1
for
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C02E.pdf
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