GRM1885C1H101J Murata, GRM1885C1H101J Datasheet - Page 213

• Manufacturer Part Number: GRM1885C1H101J
• Manufacturer: Murata

Specifications of GRM1885C1H101J

• Capacitance: 100pF
• Tolerance (+ Or -): 5%
• Voltage: 50VDC
• Temp Coeff (dielectric): C0G
• Operating Temp Range: -55C to 125C
• Mounting Style: Surface Mount
• Package / Case: 0603
• Construction: SMT Chip
• Case Style: Ceramic Chip
• Failure Rate: Not Required
• Wire Form: Not Required
• Product Length (mm): 1.6mm
• Product Depth (mm): 0.8mm
• Product Height (mm): 0.8mm
• Product Diameter (mm): Not Requiredmm
• Dc: 07+
• Lead Free Status / Rohs Status: Compliant

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
4. Reflow Soldering
Table 1
Recommended Conditions
Optimum Solder Amount for Reflow Soldering
Peak Temperature
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Inverting the PCB
Solderability of Tin plating termination chip might be
When components are immersed in solvent after
Overly thick application of solder paste results in
Too little solder paste results in a lack of adhesive
Make sure the solder has been applied smoothly to the
When sudden heat is given to the components, the
mechanical strength of the components should go down
because remarkable temperature change causes
deformity of components inside. In order to prevent
mechanical damage in the components, preheating
should be required for both of the components and the
PCB board. Preheating conditions are shown in Table 1.
It is required to keep temperature differential between the
soldering and the components surface ( T) as small as
possible.
deteriorated when low temperature soldering profile
where peak solder temperature is below the Tin melting
point is used. Please confirm the solderability of Tin
plating termination chip before use.
mounting, be sure to maintain the temperature difference
( T) between the component and solvent within the
range shown in the Table 1.
excessive fillet height solder.
This makes the chip more susceptible to mechanical and
thermal stress on the board and may cause cracked
chips.
strength on the outer electrode, which may result in chips
breaking loose from the PCB.
end surface to a height of 0.2mm min.
Make sure not to impose an abnormal mechanical shock on
the PCB.
Atmosphere
Continued from the preceding page.
G--18/21/31
G--32/42/43/52/55
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Part Number
Infrared Reflow
230-250 C
Air
Pb-Sn Solder
Vapor Reflow
230-240 C
Air
Temperature Differential
TV190D
TV130D
Lead Free Solder
240-260 C
Air or N
2
[Standard Conditions for Reflow Soldering]
[Allowable Soldering Temperature and Time]
[Optimum Solder Amount for Reflow Soldering]
Peak Temperature
Peak Temperature
Temperature (D)
Temperature (D)
In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
270
260
250
240
230



































200 C
170 C
150 C
130 C
170 C
150 C
130 C
0





Infrared Reflow
Vapor Reflow
T
T
30
60-120 seconds 30-60 seconds
60-120 seconds













Preheating
Preheating
60
Continued on the following page.
Soldering
20 seconds max.
Soldering
Soldering Time (sec.)
90
!Caution
Gradual
Cooling
Gradual
Cooling
Time
Time
in section
0.2mm min.
211
C02E.pdf
09.9.18
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