GRM1885C1H101J Murata, GRM1885C1H101J Datasheet - Page 217

• Manufacturer Part Number: GRM1885C1H101J
• Manufacturer: Murata

Specifications of GRM1885C1H101J

• Capacitance: 100pF
• Tolerance (+ Or -): 5%
• Voltage: 50VDC
• Temp Coeff (dielectric): C0G
• Operating Temp Range: -55C to 125C
• Mounting Style: Surface Mount
• Package / Case: 0603
• Construction: SMT Chip
• Case Style: Ceramic Chip
• Failure Rate: Not Required
• Wire Form: Not Required
• Product Length (mm): 1.6mm
• Product Depth (mm): 0.8mm
• Product Height (mm): 0.8mm
• Product Diameter (mm): Not Requiredmm
• Dc: 07+
• Lead Free Status / Rohs Status: Compliant

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
Land Layout to Prevent Excessive Solder
2. Mounting of Chips
3. Soldering
(1) Limit of losing effective area of the terminations and
Examples of
Prohibition
Examples of
Improvements
by the Land
Division
Thickness of adhesives applied
Keep thickness of adhesives applied (50-105 m or more)
to reinforce the adhesive contact considering the
thickness of the termination or capacitor (20-70 m) and
the land pattern (30-35 m).
Mechanical shock of the chip placer
When the positioning claws and pick-up nozzle are worn,
the load is applied to the chip while positioning is
concentrated in one position, thus causing cracks,
breakage, faulty positioning accuracy, etc.
Careful checking and maintenance are necessary to
prevent unexpected trouble.
An excessively low bottom dead point of the suction
nozzle imposes great force on the chip during mounting,
causing cracked chips. Please set the suction nozzle's
bottom dead point on the upper surface of the board.
conditions needed for soldering.
Continued from the preceding page.
Depending on the conditions of the soldering
temperature and/or immersion (melting time),
effective areas may be lost in some part of the
terminations.
To prevent this, be careful in soldering so that any
possible loss of the effective area on the terminations
will securely remain at a maximum of 25% on all
edge length A-B-C-D-A of part with A, B, C, D, shown
in the Figure below.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Solder Resist
Mounting Close to a Chassis
d
d
1
Chassis
2
Land Pattern
B
Base board
Solder (Ground solder)
d
C
1
<d
Adhesive
2
in section
in section
A
D
Termination
Mounting with Leaded Components
Solder Resist
(2) Flux Application
An excessive amount of flux generates a large quantity of
Flux containing too high percentage of halide may cause
Do not use strong acidic flux.
Do not use water-soluble flux*.
(*Water-soluble flux can be defined as non rosin type flux
flux gas, causing deteriorated solderability. So apply flux
thinly and evenly throughout. (A foaming system is
generally used for flow soldering.)
corrosion of the outer electrodes unless sufficient
cleaning. Use flux with a halide content of 0.2% max.
including wash-type flux and non-wash-type flux.)
Lead Wire Connected
to a Part Provided
with Lead Wires.
in section
in section
Mounting Leaded Components Later
Continued on the following page.
Solder Resist
Soldering Iron
Lead Wire of
Component to be
Connected Later.
Notice
in section
in section
215
C02E.pdf
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