GRM1885C1H101J Murata, GRM1885C1H101J Datasheet - Page 159

• Manufacturer Part Number: GRM1885C1H101J
• Manufacturer: Murata

Specifications of GRM1885C1H101J

• Capacitance: 100pF
• Tolerance (+ Or -): 5%
• Voltage: 50VDC
• Temp Coeff (dielectric): C0G
• Operating Temp Range: -55C to 125C
• Mounting Style: Surface Mount
• Package / Case: 0603
• Construction: SMT Chip
• Case Style: Ceramic Chip
• Failure Rate: Not Required
• Wire Form: Not Required
• Product Length (mm): 1.6mm
• Product Depth (mm): 0.8mm
• Product Height (mm): 0.8mm
• Product Diameter (mm): Not Requiredmm
• Dc: 07+
• Lead Free Status / Rohs Status: Compliant

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
7. Coating
1. A crack may be caused in the capacitor due to the stress
8. Die Bonding/Wire Bonding (GMA or GMD Series)
1. Die Bonding of Capacitors
Notice
of the thermal contraction of the resin during curing
process.
The stress is affected by the amount of resin and curing
contraction.
Select a resin with small curing contraction.
The difference in the thermal expansion coefficient
between a coating resin or a molding resin and capacitor
may cause the destruction and deterioration of the
capacitor such as a crack or peeling, and lead to the
deterioration of insulation resistance or dielectric
breakdown.
• Use the following materials for the Brazing alloys:
• Mounting
Continued from the preceding page.
Au-Sn (80/20) 300 to 320 degree C in N
(1) Control the temperature of the substrate so it
(2) Place the brazing alloy on the substrate and place
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
matches the temperature of the brazing alloy.
the capacitor on the alloy. Hold the capacitor and
gently apply the load. Be sure to complete the
operation within 1 minute.
2
atmosphere
2. Select a resin that is less hygroscopic.
2. Wire Bonding
Select a resin for which the thermal expansion coefficient
is as close to that of capacitor as possible.
A silicone resin can be used as an under-coating to buffer
against the stress.
Using hygroscopic resins under high humidity conditions
may cause the deterioration of the insulation resistance of
a capacitor.
An epoxy resin can be used as a less hygroscopic resin.
• Wire
• Bonding
Gold wire: 25 micro m (0.001 inch) diameter
(1) Thermo compression, ultrasonic ball bonding.
(2) Required stage temperature: 150 to 200 degree C
(3) Required wedge or capillary weight: 0.2N to 0.5N
(4) Bond the capacitor and base substrate or other
devices with gold wire.
Notice
157
C02E.pdf
09.9.18
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