GRM1885C1H101J Murata, GRM1885C1H101J Datasheet - Page 164

• Manufacturer Part Number: GRM1885C1H101J
• Manufacturer: Murata

Specifications of GRM1885C1H101J

• Capacitance: 100pF
• Tolerance (+ Or -): 5%
• Voltage: 50VDC
• Temp Coeff (dielectric): C0G
• Operating Temp Range: -55C to 125C
• Mounting Style: Surface Mount
• Package / Case: 0603
• Construction: SMT Chip
• Case Style: Ceramic Chip
• Failure Rate: Not Required
• Wire Form: Not Required
• Product Length (mm): 1.6mm
• Product Depth (mm): 0.8mm
• Product Height (mm): 0.8mm
• Product Diameter (mm): Not Requiredmm
• Dc: 07+
• Lead Free Status / Rohs Status: Compliant

8
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
4. Board Bending Strength for Board Material
(1) Test Method
(2) Test Samples
(3) Acceptance Criteria
(4) Results
162
Table 4
Reference Data
Characteristics
Solder the chip to the test board. Then bend the board
using the method illustrated below, to measure
capacitance.
GRM21 5C/R7/F5 Characteristics T=0.6mm typical
Products should be determined to be defective if the
change in capacitance has exceeded the values specified
in Table 4.
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
5C
R7
F5
100
100
Within T5% or T0.5pF, whichever is greater
Within T12.5%
Within T20%
80
60
40
20
80
60
40
20
0
0
: Copper Foil (0.035mm thick)
: Solder Resist
0
0
45
GRM21 5C (T=0.6)
GRM21 F5 (T=0.6)
1.2
Glass Epoxy
Glass Epoxy
100
Change in Capacitance
2
2
45
Capacitor
Flexure (mm)
Flexure (mm)
4.0
4
4
Supporting
Base
Paper Phenol
Paper Phenol
6
6
8
8
1.6
R230
Capacitance Meter
20 50
Solder Amount
100
80
60
40
20
Pressurize
0
0
GRM21 R7 (T=0.6)
Pressurizing
Speed : 1.0mm/sec.
Glass Epoxy
Flexure
2
Note : Material of the pressurizing jig and
Flexure (mm)
the supporting base must be hardened steel
(Hardness : HB183 to 255 or carbide Hardness
: HRA90 min.)
4
Paper Phenol
6
Continued on the following page.
Up to Chip
Thickness
8
(in mm)
C02E.pdf
09.9.18