NX3008CBKV NXP Semiconductors, NX3008CBKV Datasheet - Page 6

Complementary N/P-channel enhancement mode Field-Effect Transistor (FET) in an ultra small and flat lead SOT666 Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology

NX3008CBKV

Manufacturer Part Number
NX3008CBKV
Description
Complementary N/P-channel enhancement mode Field-Effect Transistor (FET) in an ultra small and flat lead SOT666 Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology
Manufacturer
NXP Semiconductors
Datasheet
NXP Semiconductors
NX3008CBKV
Product data sheet
Fig 5.
Fig 6.
Z
Z
(K/W)
(K/W)
th(j-a)
th(j-a)
10
10
10
10
10
10
1
1
3
2
3
2
10
10
FR4 PCB, standard footprint
TR1: Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
FR4 PCB, mounting pad for drain 1 cm
TR1: Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
−3
−3
duty cycle = 1
duty cycle = 1
0.25
0.25
0.5
0.1
0.5
0.1
0
0
0.75
0.33
0.05
0.75
0.33
0.05
0.02
0.01
0.2
0.02
0.01
0.2
10
10
−2
−2
All information provided in this document is subject to legal disclaimers.
10
10
−1
−1
2
Rev. 1 — 29 July 2011
1
1
30 / 30 V, 400 / 220 mA N/P-channel Trench MOSFET
10
10
NX3008CBKV
10
10
2
2
t
t
p
p
© NXP B.V. 2011. All rights reserved.
(s)
(s)
017aaa064
017aaa065
10
10
3
3
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