tspc106 ATMEL Corporation, tspc106 Datasheet - Page 36

• Manufacturer Part Number: tspc106
• Description: Ic Pci Mem Ctrlr 66mhz 303cbga
• Manufacturer: ATMEL Corporation

Table 21. Pull-up/Pull-down Recommendations
Preparation for Delivery
Packaging
Certificate of Compliance
Handling
36
Signal Type
60x bus control
60x bus address/transfer attributes
Cache control
PCI bus control
JTAG
Factory test
TSPC106A
Microcircuits are prepared for delivery in accordance with MIL-PRF-38535.
Atmel offers a certificate of compliance with each shipment of parts, confirming that the
products are in compliance with MIL-STD-883 and guaranteeing the parameters not
tested at temperature extremes for the entire temperature range.
MOS devices must be handled with certain precautions to avoid damage due to accu-
mulation of static charge. Input protection devices have been designed in the chip to
minimize the effect of this static buildup. However, the following handling practices are
recommended:
•
•
•
•
•
•
Signals
BRn, TS, XATS, AACK, ARTRY, TA
A[0:31], TT[0:4], TBST, WT, CI, GBL
ADS
HIT, TV
REQ, FRAME, IRDY, DEVSEL, TRDY,
STOP, SERR, PERR, LOCK, FLSHREQ,
ISA_MASTER
TRST
LSSD_MODE
Devices should be handled on benches with conductive and grounded surfaces.
Ground test equipment, tools and operator.
Do not handle devices by the leads.
Store devices in conductive foam or carriers.
Avoid use of plastic, rubber or silk in MOS areas.
Maintain relative humidity above 50% if practical.
Pull-up/Pull-down
Pull-up to 3.3V dc
Pull-up to 3.3V dc
Pull-up to 3.3V dc
Pull-up to 3.3V dc or pull-down to GND
depending on programmed polarity
Pull-up to 5V dc
Note: For closed systems not requiring 5V
power, these may be pulled up to 3.3 VDC.
Pull-down to GND (during normal system
operation)
Pull-up to 3.3V dc
2102C–HIREL–01/05