m58bw32f STMicroelectronics, m58bw32f Datasheet - Page 64

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m58bw32f

Manufacturer Part Number
m58bw32f
Description
16 Or 32 Mbit X32, Boot Block, Burst 3.3v Supply Flash Memories
Manufacturer
STMicroelectronics
Datasheet

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Package mechanical
8
64/87
Package mechanical
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. ECOPACK® packages are lead-free. The category of second-level interconnect
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the inner
box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 24. LBGA80 10 × 12 mm - 8 × 10 ball array, 1 mm pitch, bottom view package
1. Drawing is not to scale.
E
outline
E1
FE
BALL "A1"
FD
A
e
SD
D1
D
b
SE
e
A1
A2
M58BW16F, M58BW32F
JE_ME
ddd

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