STPC4EDBC STMICROELECTRONICS [STMicroelectronics], STPC4EDBC Datasheet - Page 61

• Manufacturer Part Number: STPC4EDBC
• Description: X86 Core PC Compatible Information Appliance System-on-Chip
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

Board
Ambient
Case
Junction
Board
Ambient
Rca
Rjc
Rjb
Rba
Figure 5-6. Thermal Dissipation With Heatsink
Board
8.5
Rja = 9.5 °C/W
Release 1.5 - January 29, 2002
3
Junction
Ambient
6
50
Case
Board dimensions:
- 10.2 cm x 12.7 cm
- 4 layers (2 for signals, 1 GND, 1VCC)
The PBGA is centred on board
There are no other devices
1 via pad per ground ball (8-mil wire)
40% copper on signal layers
Copper thickness:
- 17µm for internal layers
- 34µm for external layers
Airflow = 0
Board temperature taken at the centre balls
Heat sink is 11.1°C/W
MECHANICAL DATA
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