STPC4EDBC STMICROELECTRONICS [STMicroelectronics], STPC4EDBC Datasheet - Page 85

• Manufacturer Part Number: STPC4EDBC
• Description: X86 Core PC Compatible Information Appliance System-on-Chip
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

To avoid solder wicking over to the via pads during
soldering, it is important to have a solder mask of
4 mil around the pad (NSMD pad). This gives a
diameter of 33 mil for a 25 mil ground pad.
6.4.5.3. Heat dissipation
The thickness of the copper on PCB layers is
typically 34 µm for external layers and 17 µm for
internal
dissipation is not good; high board temperatures
are concentrated around the devices and these
fall quickly with increased distance.
Where possible, place a metal layer inside the
PCB; this improves dramatically the spread of
Metal planes
layers.
Figure 6-29. Optimum Layout for Central Ground Ball - top layer
This
Figure 6-30. Use of Metal Plate for Thermal Dissipation
means
that
Release 1.5 - January 29, 2002
thermal
Die
To obtain the optimum ground layout, place the
vias directly under the ball pads. In this case no
local board distortion is tolerated.
heat and hence the thermal dissipation of the
board.
The possibility of using the whole system box for
thermal dissipation is very useful in cases of high
internal
temperatures. Bottom side of the PBGA should be
thermally connected to the metal chassis in order
to propagate the heat flow through the metal.
Thermally connecting also the top side will
improve furthermore the heat dissipation.
6-30
illustrates such an implementation.
temperatures
Clearance = 6mil
External diameter = 37 mil
Via to Ground layer
hole diameter = 14 mil
Solder mask
diameter = 33 mil
Pad for ground ball
diameter = 25 mil
connections = 10 mil
DESIGN GUIDELINES
Thermal conductor
and
low
Board
outside
Figure
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