MC68HC912D60A MOTOROLA [Motorola, Inc], MC68HC912D60A Datasheet - Page 407
MC68HC912D60A
Manufacturer Part Number
MC68HC912D60A
Description
Microcontrollers
Manufacturer
MOTOROLA [Motorola, Inc]
Datasheet
1.MC68HC912D60A.pdf
(460 pages)
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MC68HC912D60A — Rev 3.0
MOTOROLA
Average junction temperature
Ambient temperature
Package thermal resistance (junction-to-ambient)
Package thermal resistance (junction-to-ambient)
Total power dissipation
Device internal power dissipation
I/O pin power dissipation
A constant
1. This is an approximate value, neglecting P
2. For most applications P
3. K is a constant pertaining to the device. Solve for K with a known T
80-pin quad flat pack (QFP)
112-pin thin quad flat pack (TQFP)
K to solve for P
(3)
D
Characteristic
and T
(1)
J
I/O
(2)
iteratively for any value of T
« P
INT
Freescale Semiconductor, Inc.
and can be neglected.
Table 20-2. Thermal Characteristics
For More Information On This Product,
I/O
Go to: www.freescale.com
.
Electrical Specifications
A
.
Symbol
P
P
Θ
Θ
P
T
T
K
INT
I/O
JA
JA
A
J
D
A
and a measured P
P
User-determined
User-determined
D
P
T
INT
A
× (T
D
I
Θ
+ (P
------------------------- -
T
DD
J
(at equilibrium). Use this value of
JA
+ P
Value
A
+
50
51
× V
K
+ 273°C) +
273°C
× P
D
I/O
× Θ
DD
D
Electrical Specifications
2
JA
or
)
Technical Data
Tables of Data
W · °C
°C/W
°C/W
Unit
°C
°C
W
W
W
407
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