TE28F008xxx Intel Corporation, TE28F008xxx Datasheet - Page 10

• Manufacturer Part Number: TE28F008xxx
• Description: (TE28F Series) 3 Volt Advanced Boot Block Flash Memory
• Manufacturer: Intel Corporation

28F004/400B3, 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
4
Figure 2. 48-Lead TSOP Package for x16 Configurations
Figure 3. x8 48-Ball µBGA* Chip Size Package (Top View, Ball Down)
NOTE: Lower densities will have NC on the upper address pins. For example, an 16-Mbit device will have NC
NOTES:
1. Shaded connections indicate the upgrade address connections. Lower density devices will not have the
2. 4-Mbit density not available in BGA* CSP.
upper address solder balls. Routing is not recommended in this area. A
16-Mbit device.
64 M
32 M
16 M
on Pins 9 and 10.
C
D
A
B
E
F
A
A
A
A
A
A
A
A
A
A
WE#
RP#
V
WP#
A
A
A
A
A
A
A
A
A
A
15
14
13
12
11
10
9
8
21
20
PP
19
18
17
7
6
5
4
3
2
1
V
GND
A
A
A
A
CCQ
1
14
15
16
17
A
A
A
NC
A
D
2
12
10
13
11
7
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
1
2
3
4
5
6
7
8
9
WE#
NC
D
D
A
A
3
8
9
5
6
RP#
V
NC
NC
Advanced Boot Block
D
4
PP
4
12 mm x 20 mm
48-Lead TSOP
TOP VIEW
8M
WP#
V
A
D
D
5
CC
19
2
3
16M
A
A
NC
NC
NC
A
6
20
18
6
20
is the upgrade address for the
CE#
A
A
A
D
D
7
7
5
3
0
1
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
GND
OE#
8
A
A
A
A
4
2
1
0
3UHOLPLQDU\
OE#
GND
CE#
A
A
V
GND
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
V
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
16
CCQ
CC
0
15
7
14
6
13
5
12
4
11
3
10
2
9
1
8
0
0580_02
0580_04