TE28F008xxx Intel Corporation, TE28F008xxx Datasheet - Page 11

• Manufacturer Part Number: TE28F008xxx
• Description: (TE28F Series) 3 Volt Advanced Boot Block Flash Memory
• Manufacturer: Intel Corporation

3UHOLPLQDU\
Figure 4. x16 48-Ball Very Thin Profile Pitch BGA and µBGA* Chip Size Package (Top View,
Ball Down)
NOTES:
Table 2, “3 Volt Advanced Boot Block Pin Descriptions” on page 6
pin.
1. Shaded connections indicate the upgrade address connections. Lower density devices will not have the
2. 4-Mbit density not available in BGA CSP.
upper address solder balls. Routing is not recommended in this area. A
16-Mbit device. A
device.
A
B
C
D
E
F
GND
V
A
A
A
A
CCQ
1
13
14
15
16
20
28F004/400B3, 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
is the upgrade address for the 32-Mbit device. A
A
A
A
D
D
D
2
11
10
12
14
15
7
WE#
D
D
D
A
A
3
13
8
9
5
6
64M
RP#
V
A
D
D
D
4
PP
21
11
12
4
32M
WP#
V
A
A
D
D
5
CC
18
20
2
3
16M
21
is the upgrade address for the 64-Mbit
A
A
D
19
A
D
D
6
details the usage of each device
19
17
10
6
8
9
is the upgrade address for the
CE#
D
D
7
A
A
A
7
5
3
0
1
GND
OE#
8
A
A
A
A
4
2
1
0
0580_03
5