PCAL6416APW,118 NXP Semiconductors, PCAL6416APW,118 Datasheet - Page 3
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PCAL6416APW,118
Manufacturer Part Number
PCAL6416APW,118
Description
Interface - I/O Expanders 16b I2C BUS INTERUPT
Manufacturer
NXP Semiconductors
Datasheet
1.PCAL6416AHF128.pdf
(54 pages)
Specifications of PCAL6416APW,118
Rohs
yes
Maximum Operating Frequency
100 kHz
Operating Supply Voltage
1.65 V to 5.5 V
Operating Temperature Range
- 40 C to + 85 C
Mounting Style
SMD/SMT
Package / Case
TSSOP-24
Operating Current
200 mA
Output Current
25 mA
Product Type
I/O Expanders
Factory Pack Quantity
2500
NXP Semiconductors
3. Ordering information
Table 1.
PCAL6416A
Product data sheet
Type number
PCAL6416AEV
PCAL6416AEX
PCAL6416AHF
PCAL6416APW
Ordering information
2.1 Agile I/O features
Topside
mark
L16A
L16
L16A
PCAL6416A
Latched outputs with 25 mA drive maximum capability for directly driving LEDs
Latch-up performance exceeds 100 mA per JESD 78, Class II
ESD protection exceeds JESD 22
Packages offered: TSSOP24, HVQFN24, VFBGA24, XFBGA24
Software backward compatible with PCA6416A with interrupts disabled at power-up
Pin-to-pin drop-in replacement with PCA6416A
Output port configuration: bank selectable push-pull or open-drain output stages
Interrupt status: read-only register identifies the source of an interrupt
Bit-wise I/O programming features:
2000 V Human-Body Model (A114-A)
1000 V Charged-Device Model (C101)
Output drive strength: four programmable drive strengths to reduce rise and fall
times in low-capacitance applications
Input latch: Input Port register values changes are kept until the Input Port register
is read
Pull-up/pull-down enable: floating input or pull-up/pull-down resistor enable
Pull-up/pull-down selection: 100 k pull-up/pull-down resistor selection
Interrupt mask: mask prevents the generation of the interrupt when input changes
state to prevent spurious interrupts
Package
Name
VFBGA24
XFBGA24
HWQFN24
TSSOP24
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 24 December 2012
Description
plastic very thin fine-pitch ball grid array package; 24 balls;
body 3 3 0.85 mm
plastic, extremely thin fine-pitch ball grid array package;
24 balls; body 2 2 0.5 mm
plastic thermal enhanced very very thin quad flat package;
no leads; 24 terminals; body 4 4 0.75 mm
plastic thin shrink small outline package; 24 leads;
body width 4.4 mm
Low-voltage translating 16-bit I
2
C-bus/SMBus I/O expander
PCAL6416A
© NXP B.V. 2012. All rights reserved.
Version
SOT1199-1
SOT1342-1
SOT994-1
SOT355-1
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