TDGL007 Microchip Technology, TDGL007 Datasheet - Page 21

• Manufacturer Part Number: TDGL007
• Description: Development Boards & Kits - PIC / DSPIC DIGILENT CEREBOT MC7 MOTOR CONTROL BRD
• Manufacturer: Microchip Technology

Specifications of TDGL007

• Product: Development Boards
• Interface Type: CAN, I2C
• Operating Supply Voltage: 5 V

2.0
2.1
Ge tt ing
dsPIC33FJXXXMCX06A/X08A/X10A family of 16-bit
Digital Signal Controllers (DSC) requires attention to a
minimal set of device pin connections before
proceeding with development. The following is a list of
pin names, which must always be connected:
• All V
• All AV
• V
• MCLR pin
• PGECx/PGEDx pins used for In-Circuit Serial
• OSC1 and OSC2 pins when external oscillator
Additionally, the following pins may be required:
• V
© 2011 Microchip Technology Inc.
(see
is not used)
(see
(see
Connection
(see
Programming™ (ICSP™) and debugging purposes
(see
source is used
(see
reference for ADC module is implemented
Note:
Note 1: This data sheet summarizes the features
REF
CAP
DD
Section 2.2 “Decoupling
Section 2.2 “Decoupling
Section 2.3 “CPU Logic Filter Capacitor
Section 2.4 “Master Clear (MCLR)
Section 2.5 “ICSP
Section 2.6 “External Oscillator
+/V
DD
2: Some registers and associated bits
GUIDELINES FOR GETTING
STARTED WITH 16-BIT
DIGITAL SIGNAL
CONTROLLERS
Basic Connection Requirements
and V
REF
and AV
The AV
connected independent of the ADC
voltage reference source.
of the dsPIC33FJXXXMCX06A/X08A/
X10A family of devices. It is not intended
to be a comprehensive reference source.
To complement the information in this
data sheet, refer to the “dsPIC33F/
PIC24H Family Reference Manual”,
which is available from the Microchip web
site (www.microchip.com).
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization”
this data sheet for device-specific register
and bit information.
- pins used when external voltage
(Vcap)”)
SS
start ed
SS
pins
DD
pins (regardless if ADC module
and AV
dsPIC33FJXXXMCX06A/X08A/X10A
Pins”)
SS
Capacitors”)
Capacitors”)
w it h
pins must be
Pins”)
Pin”)
th e
in
2.2
The use of decoupling capacitors on every pair of
power supply pins, such as V
AV
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: Recommendation
• Placement on the printed circuit board: The
• Handling high-frequency noise: If the board is
• Maximizing performance: On the board layout
of 0.1 μF (100 nF), 10-20V. This capacitor should
be a low-ESR and have resonance frequency in
the range of 20 MHz and higher. It is
recommended that ceramic capacitors be used.
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is within
one-quarter inch (6 mm) in length.
experiencing high-frequency noise, upward of
tens of MHz, add a second ceramic type capacitor
in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 μF to 0.001 μF. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 μF in parallel with 0.001 μF.
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum, thereby reducing PCB track
inductance.
SS
is required.
Decoupling Capacitors
DD
, V
DS70594C-page 21
SS
, AV
DD
and