TLE6232GP Infineon Technologies, TLE6232GP Datasheet - Page 4
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TLE6232GP
Manufacturer Part Number
TLE6232GP
Description
IC SW SMART 6-CH LOWSIDE PDSO36
Manufacturer
Infineon Technologies
Type
Low Sider
Datasheet
1.TLE6232GP.pdf
(20 pages)
Specifications of TLE6232GP
Input Type
SPI
Number Of Outputs
6
On-state Resistance
250 mOhm, 450 mOhm
Current - Output / Channel
550mA, 1.1A
Current - Peak Output
2A, 4A
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 150°C
Mounting Type
Surface Mount
Package / Case
DSO-36
Packages
PG-DSO-36
Thermal Class
Heatslug down
Id Nom
4 x 1, 2 x 0.5 A
Pin Count
36.0 Pins
Channels
6.0
Comment
general purpose (e.g. 4x injectors, 2x relays)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
SP000012541
SP000308875
SP000691110
TLE6232GP
TLE6232GPNT
TLE6232GPT
TLE6232GPT
TLE6232GPTR
TLE6232GPXT
SP000308875
SP000691110
TLE6232GP
TLE6232GPNT
TLE6232GPT
TLE6232GPT
TLE6232GPTR
TLE6232GPXT
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TLE6232GP
Manufacturer:
Infineon
Quantity:
2 913
Part Number:
TLE6232GP
Manufacturer:
INFINEON/英飞凌
Quantity:
20 000
Maximum Ratings for T
Parameter
Supply Voltage
Continuous Drain Source Voltage (OUT1...OUT8)
Input Voltage, All Inputs and Data Lines
Operating Temperature Range
Storage Temperature Range
Output Current per Channel (see el. characteristics)
Single pulse inductive Energy (internal clamping)
T
Output Current per Channel @ T
(All 6 Channels ON; Mounted on PCB )
Power Dissipation (mounted on PCB) @ TA = 25°C
Electrostatic Discharge Voltage (Human Body Model)
according to MIL STD 883D, method 3015.7 and EOS/ESD
assn. standard S5.1 - 1993
DIN Humidity Category, DIN 40 040
IEC Climatic Category, DIN IEC 68-1
Thermal Resistance
junction – case (die soldered on the frame)
junction - ambient @ min. footprint
junction - ambient @ 6 cm
1
V2.3
) Output current rating so long as maximum junction temperature is not exceeded. At T
Minimum footprint
j
=125°C,
current has to be calculated using R
2
j
cooling area with heat pipes
= – 40°C to 150°C
Ch1-4: 3A linear decreasing
Ch5,6: 1,5A linear decreasing
A
= 25°C
thJA
according mounting conditions.
1
)
Page
PCB with heat pipes,
backside 6 cm
4
Symbol
V
V
V
T
T
I
E
I
I
R
R
D(lim)
D 1-4
D 5,6
P
V
j
stg
S
DS
IN
thJC
thJA
tot
ESD
2
Data Sheet TLE 6232 GP
cooling area
Values
-0.3 ... +7
45
- 0.3 ... + 7
- 40 ... + 150
- 55 ... + 150
I
40
20
1.1
0.55
3.3
2000
E
40/150/56
2
50
38
D(lim) min
A
= 125 °C the output
2009-11-18
K/W
Unit
mJ
°C
W
V
V
V
A
A
V