MPC8313E-RDB Freescale Semiconductor, MPC8313E-RDB Datasheet - Page 85

• Manufacturer Part Number: MPC8313E-RDB
• Description: BOARD PROCESSOR
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC II™ PROr
• Type: MCUr

Specifications of MPC8313E-RDB

• Contents: Reference Design Board, Software and Documentation
• Termination Type: SMD
• Supply Voltage Max: 1.05V
• Tool / Board Applications: Wired Connectivity-LIN, CAN, Ethernet, USB
• Mcu Supported Families: POWERQUICC II PRO
• Rohs Compliant: Yes
• Filter Terminals: SMD
• Silicon Manufacturer: Freescale
• Silicon Core Number: MPC83xx
• Kit Application Type: Communication & Networking
• Application Sub Type: Ethernet
• Core Architecture: Power Architecture
• Silicon Family Name: PowerQUICC II PRO
• For Use With/related Products: MPC8313E
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

R
change the case-to-ambient thermal resistance,
sink, the airflow around the device, the interface material, the mounting arrangement on the printed-circuit
board, or change the thermal dissipation on the printed-circuit board surrounding the device.
To illustrate the thermal performance of the devices with heat sinks, the thermal performance has been
simulated with a few commercially available heat sinks. The heat sink choice is determined by the
application environment (temperature, airflow, adjacent component power dissipation) and the physical
space available. Because there is not a standard application environment, a standard heat sink is not
required.
Accurate thermal design requires thermal modeling of the application environment using computational
fluid dynamics software which can model both the conduction cooling and the convection cooling of the
air moving through the application. Simplified thermal models of the packages can be assembled using the
junction-to-case and junction-to-board thermal resistances listed in
models can be made available on request.
Freescale Semiconductor
θ
JC
is device related and cannot be influenced by the user. The user controls the thermal environment to
Heat Sink Assuming Thermal Grease
Table 71. Thermal Resistance for TEPBGAII with Heat Sink in Open Flow
Wakefield 53 × 53 × 2.5 mm pin fin
MPC8313E PowerQUICC
Aavid 43 × 41 × 16.5 mm pin fin
Aavid 35 × 31 × 23 mm pin fin
Aavid 30 × 30 × 9.4 mm pin fin
™
II Pro Processor Hardware Specifications, Rev. 3
R
θ
CA
. For instance, the user can change the size of the heat
Natural convection
Natural convection
Natural convection
Natural convection
Airflow
0.5 m/s
0.5 m/s
0.5 m/s
0.5 m/s
1 m/s
2 m/s
4 m/s
1 m/s
2 m/s
4 m/s
1 m/s
2 m/s
4 m/s
1 m/s
2 m/s
4 m/s
Table
Thermal Resistance
71. More detailed thermal
(°C/W)
13.0
10.6
14.4
11.3
10.5
16.5
13.5
12.1
10.9
10.0
14.5
11.7
10.5
9.7
9.2
8.9
9.9
9.4
9.7
9.2
Thermal
85