ATTINY2313-20PU Atmel, ATTINY2313-20PU Datasheet - Page 157

• Manufacturer Part Number: ATTINY2313-20PU
• Description: IC MCU AVR 2K FLASH 20DIP
• Manufacturer: Atmel
• Series: AVR® ATtinyr

Specifications of ATTINY2313-20PU

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 18
• Program Memory Size: 2KB (1K x 16)
• Program Memory Type: FLASH
• Eeprom Size: 128 x 8
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 20-DIP (0.300", 7.62mm)
• Package: 20PDIP
• Device Core: AVR
• Family Name: ATtiny
• Maximum Speed: 20 MHz
• Operating Supply Voltage: 3.3|5 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 18
• Interface Type: SPI/USART/USI
• Number Of Timers: 2
• Processor Series: ATTINY2x
• Core: AVR8
• Data Ram Size: 128 B
• Maximum Clock Frequency: 20 MHz
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: EWAVR, EWAVR-BL
• Development Tools By Supplier: ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT
• Minimum Operating Temperature: - 40 C
• Cpu Family: ATtiny
• Device Core Size: 8b
• Frequency (max): 20MHz
• Total Internal Ram Size: 128Byte
• # I/os (max): 18
• Number Of Timers - General Purpose: 2
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Through Hole
• Pin Count: 20
• Package Type: PDIP
• For Use With: ATSTK600-DIP40 - STK600 SOCKET/ADAPTER 40-PDIP770-1007 - ISP 4PORT ATMEL AVR MCU SPI/JTAGATAVRDRAGON - KIT DRAGON 32KB FLASH MEM AVRATAVRISP2 - PROGRAMMER AVR IN SYSTEMATJTAGICE2 - AVR ON-CHIP D-BUG SYSTEM
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Preventing Flash
Corruption
Programming Time for
Flash when Using
SPM
2543L–AVR–08/10
During periods of low V
too low for the CPU and the Flash to operate properly. These issues are the same as for board
level systems using the Flash, and the same design solutions should be applied.
A Flash program corruption can be caused by two situations when the voltage is too low. First, a
regular write sequence to the Flash requires a minimum voltage to operate correctly. Secondly,
the CPU itself can execute instructions incorrectly, if the supply voltage for executing instructions
is too low.
Flash corruption can easily be avoided by following these design recommendations (one is
sufficient):
1. Keep the AVR RESET active (low) during periods of insufficient power supply voltage.
2. Keep the AVR core in Power-down sleep mode during periods of low V
The calibrated RC Oscillator is used to time Flash accesses.
gramming time for Flash accesses from the CPU.
Table 63. SPM Programming Time
Flash write (Page Erase, Page Write,
and write Lock bits by SPM)
This can be done by enabling the internal Brown-out Detector (BOD) if the operating volt-
age matches the detection level. If not, an external low V
used. If a reset occurs while a write operation is in progress, the write operation will be
completed provided that the power supply voltage is sufficient.
vent the CPU from attempting to decode and execute instructions, effectively protecting
the SPMCSR Register and thus the Flash from unintentional writes.
Symbol
CC
, the Flash program can be corrupted because the supply voltage is
Min Programming Time
3.7 ms
CC
reset protection circuit can be
Table 63
Max Programming Time
4.5 ms
shows the typical pro-
CC
. This will pre-
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