MC9S12D64MFUE Freescale Semiconductor, MC9S12D64MFUE Datasheet - Page 80

IC MCU 64K FLASH 25MHZ 80-QFP

MC9S12D64MFUE

Manufacturer Part Number
MC9S12D64MFUE
Description
IC MCU 64K FLASH 25MHZ 80-QFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet

Specifications of MC9S12D64MFUE

Core Processor
HCS12
Core Size
16-Bit
Speed
25MHz
Connectivity
CAN, I²C, SCI, SPI
Peripherals
PWM, WDT
Number Of I /o
59
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 5.25 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
80-QFP
Processor Series
S12D
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
4 KB
Interface Type
CAN/I2C/SCI/SPI
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
49
Number Of Timers
8
Operating Supply Voltage
4.5 V to 5.25 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
M68KIT912DP256
Minimum Operating Temperature
- 40 C
On-chip Adc
2 (8-ch x 10-bit)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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MC9S12DJ64 Device User Guide — V01.20
Consult the FTS64K Block User Guide for information about the flash module.
The "S12 LRAE" is a generic Load RAM and Execute (LRAE) program which will be programmed into
the flash memory of this device during manufacture. This LRAE program will provide greater
programming flexibility to the end users by allowing the device to be programmed directly using CAN or
SCI after it is assembled on the PCB. Use of the LRAE program is at the discretion of the end user and,
if not required, it must simply be erased prior to flash programming. For more details of the S12 LRAE
and its implementation, please see the S12 LREA Application Note (AN2546/D).
It is planned that most HC9S12 devices manufactured after Q1 of 2004 will be shipped with the S12 LRAE
programmed in the Flash . Exact details of the changeover (ie blank to programmed) for each product will
be communicated in advance via GPCN and will be traceable by the customer via datecode marking on
the device.
Please contact Freescale SPS Sales if you have any additional questions.
Section 17 EEPROM 1K Block Description
Consult the EETS1K Block User Guide for information about the EEPROM module.
Section 18 RAM Block Description
This module supports single-cycle misaligned word accesses.
Section 19 MSCAN Block Description
Consult the MSCAN Block User Guide for information about the Freescale Scalable CAN Module.
Section 20 Port Integration Module (PIM) Block Description
Consult the PIM_9DJ64 Block User Guide for information about the Port Integration Module.
Section 21 Voltage Regulator (VREG) Block Description
Consult the VREG Block User Guide for information about the dual output linear voltage regulator.
Section 22 Printed Circuit Board Layout Proposals
80

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