PIC18LF25K22-I/SP Microchip Technology, PIC18LF25K22-I/SP Datasheet - Page 424

• Manufacturer Part Number: PIC18LF25K22-I/SP
• Description: MCU 8BIT 32KB FLASH 3.6V 28SDIP
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 18Fr

Specifications of PIC18LF25K22-I/SP

• Program Memory Type: FLASH
• Program Memory Size: 32KB (16K x 16)
• Package / Case: 28-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 64MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 24
• Eeprom Size: 256 x 8
• Ram Size: 1.5K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 19x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18LF
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 1536 B
• Interface Type: I2C, SPI, EUSART
• Maximum Clock Frequency: 64 MHz
• Number Of Programmable I/os: 25
• Number Of Timers: 7
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164005
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 17 Channel
• On-chip Dac: 5 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

PIC18(L)F2X/4XK22
27.2
DS41412D-page 424
Power-down Base Current (IPD)
D006
Power-down Module Differential Current (delta IPD)
D007
D008
D009
D010
Note 1:
Param
PIC18LF2X/4XK22
PIC18F2X/4XK22
No.
2:
3:
DC Characteristics: Power-Down Current, PIC18(L)F2X/4XK22
Sleep mode
Watchdog Timer
Brown-out Reset
Brown-out Reset
High/Low Voltage Detect
Device Characteristics
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
BOR, HLVD and FVR enable internal band gap reference. With both modules enabled, current consump-
tion will be less than the sum of both specifications.
A/D converter differential currents apply only in Run mode. In Sleep or Idle mode both the ADC and the
FRC turn off as soon as conversion (if any) is complete.
(2)
(2)
(1)
(2)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Standard Operating Conditions (unless otherwise stated)
Operating temperature
+25°C
TBD
TBD
TBD
TBD
TBD
0.02
0.02
Typ
0.3
0.5
0.3
0.5
0.5
0.0
0.0
10
11
12
10
12
25
30
65
+60°C
Typ
Preliminary
+85°C
TBD
TBD
TBD
TBD
TBD
Max
2.5
2.5
2.5
2.5
2.5
0.0
0.0
25
25
25
20
20
40
50
90
2
2
+125°C
-40°C  T
-40°C  T
TBD
TBD
TBD
TBD
TBD
Max
2.5
2.5
2.5
2.5
2.5
0.0
0.0
10
10
35
35
35
20
20
40
50
90
A
A
Units
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
 +125°C
 +125°C
1.8V-
1.8V-
1.8V
3.0V
1.8V
1.8V
1.8V
3.0V
5.0V
2.0V
3.0V
2.0V
3.0V
5.0V
3.6V
5.5V
2.0V
3.0V
2.0V
3.0V
5.0V
3.0V
5.0V
3.0V
V
DD
 2010 Microchip Technology Inc.
WDT, BOR, FVR and
SOSC disabled, all Periph-
erals inactive
Sleep mode,
BOREN<1:0> = 10
Conditions
Notes
DD
or V
SS