MCIMX355AJQ5CR2 Freescale Semiconductor, MCIMX355AJQ5CR2 Datasheet - Page 21

• Manufacturer Part Number: MCIMX355AJQ5CR2
• Description: MULTIMEDIA PROCESSOR 400-MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: i.MX35r

Specifications of MCIMX355AJQ5CR2

• Core Processor: ARM11
• Core Size: 32-Bit
• Speed: 532MHz
• Connectivity: 1-Wire, CAN, EBI/EMI, Ethernet, I²C, MMC, SPI, SSI, UART/USART, USB OTG
• Peripherals: DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 96
• Program Memory Type: ROMless
• Ram Size: 128K x 8
• Voltage - Supply (vcc/vdd): 1.33 V ~ 1.47 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 400-MAPBGA
• Processor Series: i.MX355
• Core: ARM1136JF-S
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details

1
2
3
4
4.7
I/O pins are of two types: GPIO and DDR. DDR pins can be configured in three different drive strength
modes: mobile DDR, SDRAM, and DDR2. The SDRAM and mobile DDR modes can be further
customized at three drive strength levels: normal, high, and max.
Table 13
Freescale Semiconductor
Junction to ambient
Junction to ambient
Junction to boards
Junction to case (top)
Junction to package top
Mobile DDR (1.8 V)
SDRAM (1.8 V)
SDRAM (3.3 V)
DDR2 (1.8 V)
Junction-to-ambient thermal resistance determined per JEDC JESD51-3 and JESD51-6. Thermal test board meets JEDEC
specification for this package.
Junction-to-board thermal resistance determined per JEDC JESD51-8. Thermal test board meets JEDEC specification for this
package.
Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is used
for the case temperature. Reported value includes the thermal resistance of the interface layer.
Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, this thermal characterization parameter is written
as Psi-JT.
Drive Mode
shows currents for the different DDR pin drive strength modes.
I/O Pin DC Electrical Characteristics
2
1
1
(at 200 ft/min)
(at 200 ft/min)
3
4
Rating
i.MX35 Applications Processors for Automotive Products, Rev. 9
Table 13. DDR Pin Drive Strength Mode Current Levels
Table 12. Thermal Resistance Data (continued)
Normal
3.6 mA
4 mA
—
—
Single layer board (1s)
Four layer board (2s2p)
Natural convection
Condition
—
—
7.2 mA
High
8 mA
—
—
Symbol
R
R
R
R
eJCtop
Ψ
eJMA
eJMA
eJB
JT
10.8 mA
13.4 mA
6.5 mA
12 mA
Max.
Value
44
27
19
10
2
ºC/W
ºC/W
ºC/W
ºC/W
ºC/W
Unit
21