MCIMX355AJQ5CR2 Freescale Semiconductor, MCIMX355AJQ5CR2 Datasheet - Page 54

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MCIMX355AJQ5CR2

Manufacturer Part Number
MCIMX355AJQ5CR2
Description
MULTIMEDIA PROCESSOR 400-MAPBGA
Manufacturer
Freescale Semiconductor
Series
i.MX35r
Datasheet

Specifications of MCIMX355AJQ5CR2

Core Processor
ARM11
Core Size
32-Bit
Speed
532MHz
Connectivity
1-Wire, CAN, EBI/EMI, Ethernet, I²C, MMC, SPI, SSI, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
96
Program Memory Type
ROMless
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
1.33 V ~ 1.47 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
400-MAPBGA
Processor Series
i.MX355
Core
ARM1136JF-S
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
 Details

Available stocks

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Part Number
Manufacturer
Quantity
Price
Part Number:
MCIMX355AJQ5CR2
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
54
DQS (input)
SDCLK_B
DQ (input)
SDCLK
Figure 34. DDR2 SDRAM DQ vs. DQS and SDCLK READ Cycle Timing Diagram
SDR SDRAM CLK parameters are measured from the 50% point—that is,
“high” is defined as 50% of signal value and “low” is defined as 50% of
signal value. DDR SDRAM CLK parameters are measured at the crossing
point of SDCLK and SDCLK (inverted clock).
Test conditions are: Capacitance 15 pF for DDR PADS. Recommended
drive strength is Medium for SDCLK and High for Address and controls.
i.MX35 Applications Processors for Automotive Products, Rev. 9
DDR26
DDR24
Table 39. DDR Single-ended Slew Rate
DATA
DATA
DDR25
NOTE
DATA
DATA
DATA
DATA
Freescale Semiconductor
DATA
DATA

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