XE1203FI063TRLF Semtech, XE1203FI063TRLF Datasheet - Page 37

IC TXRX 433/868/915MHZ 48-VQFN

XE1203FI063TRLF

Manufacturer Part Number
XE1203FI063TRLF
Description
IC TXRX 433/868/915MHZ 48-VQFN
Manufacturer
Semtech
Datasheets

Specifications of XE1203FI063TRLF

Frequency
180MHz Center
Data Rate - Maximum
152.3kbps
Modulation Or Protocol
FSK
Applications
AMR, ISM, Home Automation, Process Control
Power - Output
0 ~ 15dBm
Sensitivity
-114dBm
Voltage - Supply
2.4 V ~ 3.6 V
Current - Receiving
14mA
Current - Transmitting
62mA
Data Interface
PCB, Surface Mount
Antenna Connector
PCB, Surface Mount
Operating Temperature
-40°C ~ 85°C
Package / Case
48-VQFN
Receiving Current
14mA
Transmitting Current
62mA
Data Rate
152.3Kbps
Modulation Type
FSK
No. Of Pins
48
Supply Voltage Range
2.4V To 3.6V
Operating Temperature Range
-40°C To +85°C
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Product Depth (mm)
7mm
Product Length (mm)
7mm
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Memory Size
-
Lead Free Status / Rohs Status
Compliant
Other names
XE1203FI063TR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
XE1203FI063TRLF
Manufacturer:
SEMTECH
Quantity:
1 100
Part Number:
XE1203FI063TRLF
Manufacturer:
Semtech
Quantity:
2 300
Part Number:
XE1203FI063TRLF
Manufacturer:
SEMTECH/美国升特
Quantity:
20 000
8
XE1203F is available in a 48-lead MLPQ RoHS green package as shown in Figure 25
Please note that the Exposed Die Pad should be connected to ground.
NOTES
© Semtech 2008
1. Controlling dimensions are in millimeters (angles in degrees)
2. This land pattern is for reference only. Consult your manufacturing group to ensure your company’s
3. Thermal vias in the land pattern of the exposed pad shall be connected to a system ground plane. Failure
4. Square package – dimensions apply in both “X” and “Y” directions
PACKAGING INFORMATION
manufacturing guidelines are met
to do so may compromise thermal and/or functional performance of the device.
(LASER MARK)
INDICATOR
PIN 1
Figure 25: Land Pattern and Package Outline Drawings
Figure 25: Land Pattern and Package Outline Drawings
bxN
37
DIM
G
C
H
K
P
X
Y
Z
NOTES
DIM
aaa
bbb
D1
A1
A2
E1
A
D
E
N
b
e
L
1. Controlling dimensions are in millimeters
2. Coplanarity applies to the exposed pad
INCHES
(.274)
.031
.000
.007
.272
.197
.272
.197
.012
MIN
DIMENSIONS
.240
.205
.205
.020
.012
.033
.307
(angles in degrees)
as well as the terminals
.020 BSC
INCHES
(.008)
NOM
.010
.276
.201
.276
.201
.016
.003
.004
48
-
-
DIMENSIONS
below.
MILLIMETERS
MAX
.039
.002
.012
.028
.205
.028
.205
.020
(6.95)
6.10
5.20
5.20
0.50
0.30
0.85
7.80
0.80
0.00
0.18
6.90
5.00
6.90
5.00
0.30
MIN
XE1203F
MILLIMETERS
0.50 BSC
www.semtech.com
(0.20)
NOM
0.25
7.00
5.10
7.00
5.10
0.40
0.08
0.10
48
-
-
MAX
1.00
0.05
0.30
7.10
5.20
7.10
5.20
0.50

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